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LMH0074SQE/NOPB

Texas Instruments

LMH0074SQE/NOPB by Texas Instruments

LMH0074SQE/NOPB by Texas Instruments is a 16-terminal analog data transmission interface with a 3.3V supply voltage and 540 Mbps data rate. It features a square package shape, operates in industrial temperature range (-40 to 85 °C), and is ideal for telecom applications as a line equalizer IC.

Median Price

$13.377

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 17 parts In-Stock

1+ parts

$3.415

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$3.415

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Verical

USA . 17 parts In-Stock

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$3.415

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17

$3.415

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Chip1Stop

Japan . 320 parts In-Stock

1+ parts

$8.730

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320

$8.730

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Rochester

USA . 267 parts In-Stock

1+ parts

$10.580

100+ parts

$10.370

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$10.160

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267

$10.580

$10.370

$10.160

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Texas Instruments

USA . 18,985 parts In-Stock

1+ parts

$12.614

100+ parts

$11.019

1k+ parts

$7.599

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18,985

$12.614

$11.019

$7.599

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Farnell

UK . 500 parts In-Stock

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$14.140

100+ parts

$9.380

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500

$14.140

$9.380

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Mouser Electronics

USA . 240 parts In-Stock

1+ parts

$19.110

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$13.200

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$11.760

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240

$19.110

$13.200

$11.760

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DigiKey

USA . 149 parts In-Stock

1+ parts

$19.110

100+ parts

$13.192

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$11.765

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149

$19.110

$13.192

$11.765

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Newark

USA . 10 parts In-Stock

1+ parts

$19.490

100+ parts

$16.200

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10

$19.490

$16.200

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Element14

Singapore . 10 parts In-Stock

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$19.510

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10

$19.510

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,086 parts In-Stock

1+ parts

$7.382

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3,086

$7.382

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Nova Conductors

Japan . 300 parts In-Stock

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$12.172

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300

$12.172

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Chip Stock

USA . 2,890 parts In-Stock

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2,890

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Vyrian

USA . 2,272 parts In-Stock

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Anansix

USA . 1,023 parts In-Stock

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Component Sense

UK . 458 parts In-Stock

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458

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Speed Components Ltd

Israel . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,993 parts In-Stock

1+ parts

$6.600

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1,993

$6.600

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Corphita

USA . 3,932 parts In-Stock

1+ parts

$6.993

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3,932

$6.993

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Parana Technologies

USA . 2,176 parts In-Stock

1+ parts

$8.929

100+ parts

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1k+ parts

$9.599

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2,176

$8.929

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$9.599

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ChromeModa Solutions

Germany . 2,521 parts In-Stock

1+ parts

$10.033

100+ parts

$8.227

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2,521

$10.033

$8.227

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IDEA Electronic Components Group

UK . 1,990 parts In-Stock

1+ parts

$10.033

100+ parts

$9.531

1k+ parts

$9.030

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1,990

$10.033

$9.531

$9.030

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Authorized Procurement Solutions

USA . 14,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,234 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,156 parts In-Stock

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Lixinc

USA . 2,928 parts In-Stock

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Kepictronics

USA . 1,499 parts In-Stock

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Perfect Parts

USA . 1,455 parts In-Stock

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DigiPath Technology Company

USA . 1,432 parts In-Stock

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$9.046

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1,432

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$9.046

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Overview

Enhance your analog data transmission interfaces with the LMH0074SQE/NOPB by Texas Instruments. With a focus on quality and reliability, Texas Instruments is a trusted manufacturer in the electronics industry. This square-shaped chip carrier offers a wide range of applications, making it versatile for various projects. Experience seamless communication and enhanced performance with this innovative product. Upgrade your systems today and unlock a world of possibilities with the LMH0074SQE/NOPB.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and secure installation onto a PCB, saving space and potentially reducing manufacturing costs.

Package Shape: SQUARE

Square package shape provides a compact form factor, making it easier to integrate into electronic devices with limited space.

Power Supplies (V): 3.3

Operates on a common power supply voltage of 3.3V, making it compatible with many standard power sources and minimizing the need for additional components.

No. of Terminals: 16

With 16 terminals, this product offers multiple connection points for enhanced signal transmission and connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers efficient heat dissipation and space-saving design, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

Capable of operating at a maximum temperature of 85°C, ensuring reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures as low as -40°C, making it suitable for use in various industrial and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and ensures stable electrical contact, enhancing the product's reliability and longevity.

Terminal Position: QUAD

QUAD terminal position allows for convenient and secure connections, ensuring stable signal transmission and reducing the risk of disconnection.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8mm, this product offers a low-profile design that can fit into tight spaces and slim electronic devices.

Width: 4 mm

Compact width of 4mm makes this product suitable for use in small form factor devices or applications with space constraints.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering during the manufacturing process.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of 260°C, ensuring reliable and robust solder joints for long-term performance.

Length: 4 mm

Compact length of 4mm makes this product suitable for integration into small electronic devices while maintaining optimal signal transmission.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh environmental conditions and operate reliably in demanding settings.

Terminal Form: NO LEAD

NO LEAD terminal form eliminates the use of lead material, making this product more environmentally friendly and compliant with modern regulations.

Maximum Supply Current: 0.077 mA

Low maximum supply current of 0.077mA helps in reducing power consumption and operating costs, making this product energy-efficient.

Telecom IC Type: LINE EQUALIZER

Line equalizer functionality helps in maintaining signal integrity and quality over long distances, making it suitable for telecom and data transmission applications.

Nominal Supply Voltage: 3.3 V

Operates on a nominal supply voltage of 3.3V, ensuring compatibility with standard power sources and reducing the need for additional voltage regulators.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65mm allows for compact placement of terminals, enhancing signal transmission efficiency and facilitating PCB design.

Data Rate: 540 Mbps

High data rate of 540 Mbps enables fast and reliable data transmission, making this product suitable for high-speed communication systems and applications.

Technical Specifications

Analog Data Transmission Interfaces LMH0074SQE/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

540 Mbps

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.077 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

LMH0074SQE/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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