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TCM4205AJ

Texas Instruments

TCM4205AJ by Texas Instruments

TCM4205AJ by Texas Instruments is an Analog Data Transmission Interface with +-5V power supplies, 28 terminals, and CMOS technology. It is used in SLIC telecom ICs for commercial applications requiring a temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,999 parts In-Stock

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7,999

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Digiode

USA . 2,380 parts In-Stock

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2,380

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Electronic Expediters

USA . 177 parts In-Stock

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177

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,678 parts In-Stock

1+ parts

$6.097

100+ parts

-

1k+ parts

$6.875

10k+ parts

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1,678

$6.097

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$6.875

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DigiPath Technology Company

USA . 429 parts In-Stock

1+ parts

$6.714

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429

$6.714

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ChromeModa Solutions

Germany . 3,219 parts In-Stock

1+ parts

$6.851

100+ parts

$5.618

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3,219

$6.851

$5.618

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IDEA Electronic Components Group

UK . 225 parts In-Stock

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$6.851

100+ parts

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$6.166

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225

$6.851

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$6.166

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AZTECH Wire

Italy . 350 parts In-Stock

1+ parts

$15.874

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350

$15.874

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One Stop Electronics

USA . 1,056 parts In-Stock

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$414.000

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1,056

$414.000

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Corphita

USA . 3,118 parts In-Stock

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3,118

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Kepictronics

USA . 95 parts In-Stock

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95

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Overview

Experience the superior quality and reliability of the TCM4205AJ by Texas Instruments, a leading manufacturer in analog data transmission interfaces. This versatile product is ideal for a wide range of applications, offering customers exceptional value and benefits. With its advanced technology and commercial-grade temperature grade, the TCM4205AJ ensures optimal performance and functionality. Trust Texas Instruments to deliver top-notch products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Power Supplies (V): +-5

The dual power supply of +-5V allows for versatile use in different systems and applications, providing a stable and balanced power source.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to integrate this interface into existing setups without requiring additional space, making it a convenient choice for installations with limited room.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this interface can withstand high temperatures without compromising performance, making it suitable for industrial and outdoor environments.

Technology: CMOS

The CMOS technology used in this interface ensures low power consumption and high noise immunity, leading to efficient and reliable data transmission.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides a standard power source for the interface, making it compatible with various systems and devices that operate on the same voltage.

Technical Specifications

Analog Data Transmission Interfaces TCM4205AJ attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-GDIP-T28

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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