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LMH0044SQ/NOPB

Texas Instruments

LMH0044SQ/NOPB by Texas Instruments

LMH0044SQ/NOPB by Texas Instruments is a 16-terminal analog data transmission interface with a 3.3V supply voltage and 1485 Mbps data rate. It features a square package shape, matte tin terminal finish, and is ideal for telecom applications requiring line equalization at temperatures ranging from 0 to 85°C.

Median Price

$17.206

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,908 parts In-Stock

1+ parts

$15.989

100+ parts

$13.966

1k+ parts

$9.632

10k+ parts

-

15,908

$15.989

$13.966

$9.632

-

Chip1Stop

Japan . 10 parts In-Stock

1+ parts

$17.100

100+ parts

$13.000

1k+ parts

$12.500

10k+ parts

-

10

$17.100

$13.000

$12.500

-

DigiKey

USA . 2,124 parts In-Stock

1+ parts

$23.150

100+ parts

$16.158

1k+ parts

$14.898

10k+ parts

-

2,124

$23.150

$16.158

$14.898

-

Mouser Electronics

USA . 148 parts In-Stock

1+ parts

$23.150

100+ parts

$16.160

1k+ parts

$14.890

10k+ parts

-

148

$23.150

$16.160

$14.890

-

Rochester

USA . 5,396 parts In-Stock

1+ parts

-

100+ parts

$13.850

1k+ parts

$12.390

10k+ parts

$11.660

5,396

-

$13.850

$12.390

$11.660

Verical

USA . 2,256 parts In-Stock

1+ parts

-

100+ parts

$17.313

1k+ parts

$15.488

10k+ parts

$14.575

2,256

-

$17.313

$15.488

$14.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,538 parts In-Stock

1+ parts

$10.545

100+ parts

-

1k+ parts

-

10k+ parts

-

1,538

$10.545

-

-

-

Vyrian

USA . 4,916 parts In-Stock

1+ parts

$11.100

100+ parts

-

1k+ parts

-

10k+ parts

-

4,916

$11.100

-

-

-

Bristol Electronics

USA . 247 parts In-Stock

1+ parts

$13.500

100+ parts

$7.763

1k+ parts

-

10k+ parts

-

247

$13.500

$7.763

-

-

Chip Stock

USA . 3,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,750

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-

-

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Anansix

USA . 2,376 parts In-Stock

1+ parts

-

100+ parts

-

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2,376

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-

-

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Sensible Micro Corp

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

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1

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 856 parts In-Stock

1+ parts

$7.800

100+ parts

-

1k+ parts

$8.348

10k+ parts

-

856

$7.800

-

$8.348

-

DigiPath Technology Company

USA . 1,667 parts In-Stock

1+ parts

$8.589

100+ parts

-

1k+ parts

-

10k+ parts

-

1,667

$8.589

-

-

-

ChromeModa Solutions

Germany . 5,916 parts In-Stock

1+ parts

$8.764

100+ parts

$7.186

1k+ parts

-

10k+ parts

-

5,916

$8.764

$7.186

-

-

IDEA Electronic Components Group

UK . 2,162 parts In-Stock

1+ parts

$8.764

100+ parts

$8.326

1k+ parts

$7.888

10k+ parts

-

2,162

$8.764

$8.326

$7.888

-

Corphita

USA . 4,216 parts In-Stock

1+ parts

$9.990

100+ parts

-

1k+ parts

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10k+ parts

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4,216

$9.990

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 20,920 parts In-Stock

1+ parts

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100+ parts

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20,920

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-

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Lixinc

USA . 19,036 parts In-Stock

1+ parts

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19,036

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S.R.D Solutions

India . 8,000 parts In-Stock

1+ parts

-

100+ parts

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8,000

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-

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Perfect Parts

USA . 3,447 parts In-Stock

1+ parts

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100+ parts

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3,447

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Alle Elektronik GmbH

Germany . 3,118 parts In-Stock

1+ parts

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100+ parts

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3,118

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-

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Kepictronics

USA . 1,100 parts In-Stock

1+ parts

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1,100

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Authorized Procurement Solutions

USA . 800 parts In-Stock

1+ parts

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100+ parts

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800

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Futuretech Components

Singapore . 181 parts In-Stock

1+ parts

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100+ parts

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181

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Overview

Enhance your analog data transmission interfaces with the LMH0044SQ/NOPB by Texas Instruments. With a reputation for top-quality manufacturing, this product offers unrivaled reliability and performance. Ideal for applications in telecommunications and high-speed data transfer, this chip carrier with a very thin profile provides efficient signal equalization at 1485 Mbps. Trust in Texas Instruments to deliver cutting-edge technology that maximizes value and ensures seamless connectivity for your projects. Elevate your designs with the LMH0044SQ/NOPB today.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and secure installation on a PCB, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape offers a compact form factor, ideal for applications where space is limited.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V provides compatibility with standard power sources, making integration into existing systems seamless.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and flexibility in design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for use in a variety of environments and conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance even in cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Terminal Position: QUAD

Quad terminal position allows for efficient signal transmission and connection stability.

Maximum Seated Height: 0.8 mm

Low seated height minimizes the overall profile of the product, making it suitable for compact designs.

Width: 4 mm

With a width of 4mm, this product is slim and space-saving, making it suitable for applications with size constraints.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for robust and reliable solder joints, especially in lead-free manufacturing processes.

Length: 4 mm

Compact length of 4mm contributes to the overall space-saving design of the product.

Terminal Form: NO LEAD

Lead-free terminal form aligns with environmental standards and regulations, making the product eco-friendly.

Maximum Supply Current: 0.077 mA

Low supply current consumption makes this product energy-efficient and suitable for battery-powered applications.

Telecom IC Type: LINE EQUALIZER

Line equalizer type is ideal for telecom applications, ensuring optimal signal quality and transmission efficiency.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm allows for dense packing of terminals, optimizing PCB real estate.

Data Rate: 1485 Mbps

High data rate capability of 1485 Mbps enables fast and efficient data transmission, suitable for high-speed communication applications.

Technical Specifications

Analog Data Transmission Interfaces LMH0044SQ/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

1485 Mbps

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.077 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

LMH0044SQ/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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