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LMH0044SQX/NOPB

Texas Instruments

LMH0044SQX/NOPB by Texas Instruments

LMH0044SQX/NOPB by Texas Instruments is a 16-terminal analog data transmission interface with a 3.3V supply voltage. It features a square package shape, matte tin terminal finish, and operates b/w 0-85°C. Ideal for telecom applications as a line equalizer IC due to its low supply current of 0.077mA and compact dimensions of 4x4mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,947 parts In-Stock

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Vyrian

USA . 3,157 parts In-Stock

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Anansix

USA . 343 parts In-Stock

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343

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Distributors (Availability)

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AZTECH Wire

Italy . 218 parts In-Stock

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$5.731

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218

$5.731

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Parana Technologies

USA . 1,158 parts In-Stock

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$15.005

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$15.426

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$15.005

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$15.426

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DigiPath Technology Company

USA . 824 parts In-Stock

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$16.522

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824

$16.522

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ChromeModa Solutions

Germany . 6,395 parts In-Stock

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$16.859

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$13.824

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6,395

$16.859

$13.824

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IDEA Electronic Components Group

UK . 1,124 parts In-Stock

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$16.859

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$16.016

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$15.173

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$16.859

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Component Stockers USA

USA . 323 parts In-Stock

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$99.990

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323

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One Stop Electronics

USA . 692 parts In-Stock

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$383.000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,496 parts In-Stock

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Corphita

USA . 3,978 parts In-Stock

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Microchip USA

USA . 478 parts In-Stock

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Overview

Experience seamless analog data transmission with the LMH0044SQX/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in their products. This square-shaped chip carrier offers a very thin profile and matte tin terminal finish, making it ideal for various applications in the telecom industry. With a nominal supply voltage of 3.3V and a maximum supply current of 0.077mA, this line equalizer ensures optimal performance while keeping power consumption low. Upgrade your systems today with the LMH0044SQX/NOPB and enjoy superior connectivity and efficiency like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and reliable mounting onto circuit boards, making installation and assembly quick and efficient.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design, ideal for applications where board space is limited.

Power Supplies (V): 3.3

Operates on a commonly used voltage of 3.3V, making it compatible with a wide range of systems and power sources.

No. of Terminals: 16

Having 16 terminals allows for versatile and comprehensive connectivity options, enabling the interface to handle multiple data signals efficiently.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier package style with heat sink/slug and very thin profile design enhances thermal performance and overall reliability of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the interface can withstand harsh environmental conditions and ensure stable performance under varying temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the interface remains operational even in colder environments, increasing its reliability and usability.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, ensuring long-term reliability and robust performance of the interface.

Terminal Position: QUAD

Quad terminal position provides a secure and stable connection, minimizing signal loss and interference for improved data transmission quality.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8mm allows for a slim and compact design, making it suitable for applications where space constraints are a concern.

Width: 4 mm

The compact width of 4mm facilitates easier integration into circuit layouts and minimizes overall footprint, making it ideal for space-constrained installations.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly, contributing to the durability and reliability of the interface.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, the interface can withstand the soldering process without damage, ensuring a secure and lasting connection.

Length: 4 mm

The short length of 4mm contributes to the overall compactness and space-saving design of the interface, making it suitable for applications with size restrictions.

Terminal Form: NO LEAD

No-lead terminal form reduces the risk of solder joint failure and improves reliability, ensuring consistent performance and signal integrity.

Maximum Supply Current: 0.077 mA

With a low maximum supply current of 0.077mA, the interface operates efficiently and consumes minimal power, making it energy-efficient and cost-effective.

Telecom IC Type: LINE EQUALIZER

Specifically designed as a line equalizer telecom IC type, the interface is optimized for enhancing signal quality and maintaining data integrity in telecommunications applications.

Nominal Supply Voltage: 3.3 V

Operates at a nominal supply voltage of 3.3V, ensuring compatibility with standard power sources and voltage levels commonly used in electronic systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting and efficient signal routing, making the interface suitable for applications requiring compact and densely populated circuit boards.

Technical Specifications

Analog Data Transmission Interfaces LMH0044SQX/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.077 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

LMH0044SQX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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