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LMH0074SQ

Texas Instruments

LMH0074SQ by Texas Instruments

LMH0074SQ by Texas Instruments is a 16-terminal analog data transmission interface in a square chip carrier package. With an operating temperature range of -40 to 85°C, it's ideal for industrial telecom applications requiring line equalization at a nominal voltage of 3.3V. The compact design with a seated height of 0.8mm and terminal pitch of 0.65mm makes it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,070 parts In-Stock

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6,070

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Digiode

USA . 527 parts In-Stock

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527

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Anansix

USA . 402 parts In-Stock

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402

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Distributors (Availability)

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AZTECH Wire

Italy . 670 parts In-Stock

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$5.322

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670

$5.322

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Parana Technologies

USA . 529 parts In-Stock

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$8.734

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$9.415

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529

$8.734

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DigiPath Technology Company

USA . 1,884 parts In-Stock

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$9.617

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$8.847

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1,884

$9.617

$8.847

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ChromeModa Solutions

Germany . 4,160 parts In-Stock

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$9.813

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$8.047

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$9.813

$8.047

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IDEA Electronic Components Group

UK . 1,179 parts In-Stock

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$9.813

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$9.322

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$8.832

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1,179

$9.813

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$8.832

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One Stop Electronics

USA . 1,075 parts In-Stock

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$35.000

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Lixinc

USA . 3,235 parts In-Stock

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Corphita

USA . 1,737 parts In-Stock

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1,737

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Overview

Unlock the potential of your analog data transmission interfaces with the LMH0074SQ by Texas Instruments. With a focus on quality and innovation, Texas Instruments offers a product that exceeds industry standards. Ideal for telecom applications, this line equalizer provides unmatched performance and reliability. Experience seamless connectivity and improved signal integrity with the LMH0074SQ, setting a new standard in analog data transmission interfaces. Elevate your projects with the value and benefits this top-tier product brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

Compact and space-saving design makes it suitable for applications where board space is limited.

No. of Terminals: 16

Provides multiple connection points for various inputs and outputs, enhancing flexibility and functionality.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments without the risk of overheating or malfunctioning.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, ensuring reliability in a wide range of operating environments.

Terminal Finish: TIN LEAD

Offers good solderability and conductivity, facilitating secure connections and signal transmission.

Width: 4 mm

Compact width allows for efficient use of space on the circuit board, ideal for applications with limited board real estate.

Length: 4 mm

Compact length contributes to the overall small form factor of the product, making it suitable for space-constrained applications.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a standard voltage level commonly used in many electronic systems, ensuring compatibility and ease of integration.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with varying temperature conditions, ensuring reliable performance in demanding applications.

Technical Specifications

Analog Data Transmission Interfaces LMH0074SQ attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LMH0074SQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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