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DS64EV100SD

Texas Instruments

DS64EV100SD by Texas Instruments

DS64EV100SD by Texas Instruments is a 14-terminal analog data transmission interface with a small outline package. Operating b/w -40 to 85°C, it features line equalizer telecom IC type and nominal voltage of 2.5V. Ideal for industrial applications requiring surface mount components with dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,381 parts In-Stock

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Digiode

USA . 4,857 parts In-Stock

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4,857

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Anansix

USA . 2,559 parts In-Stock

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2,559

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Distributors (Availability)

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Native Components

USA . 572 parts In-Stock

1+ parts

$6.450

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572

$6.450

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AZTECH Wire

Italy . 297 parts In-Stock

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$12.889

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297

$12.889

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Parana Technologies

USA . 1,628 parts In-Stock

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$14.734

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$15.173

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1,628

$14.734

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$15.173

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DigiPath Technology Company

USA . 1,079 parts In-Stock

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$16.224

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1,079

$16.224

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ChromeModa Solutions

Germany . 3,893 parts In-Stock

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$16.555

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$13.575

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3,893

$16.555

$13.575

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IDEA Electronic Components Group

UK . 1,636 parts In-Stock

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$16.555

100+ parts

$15.727

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$14.900

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1,636

$16.555

$15.727

$14.900

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One Stop Electronics

USA . 1,254 parts In-Stock

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$220.000

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1,254

$220.000

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Corphita

USA . 2,875 parts In-Stock

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2,875

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Northwest PG Solutions

USA . 1,986 parts In-Stock

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$6.321

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1,986

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$6.321

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Overview

Discover the DS64EV100SD by Texas Instruments, a high-quality Analog Data Transmission Interface designed to meet your connectivity needs. With Texas Instruments' reputation for excellence in manufacturing, this compact device offers unmatched reliability and performance. Ideal for telecom applications, the DS64EV100SD ensures seamless data transmission with its advanced features. Experience the value and benefits of this innovative product, providing you with a competitive edge in the industry. Elevate your projects with the DS64EV100SD and unlock endless possibilities in communication technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving time and space in the design.

Package Shape: RECTANGULAR

Rectangular shape helps in easy handling and placement of the component on the PCB, ensuring proper alignment for soldering.

No. of Terminals: 14

With 14 terminals, this product can support multiple connections and signals, making it versatile for various applications.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers a compact design with enhanced heat dissipation capabilities, ideal for space-constrained environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments where temperatures can fluctuate.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold conditions without compromising performance or reliability.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity, ensuring secure connections and reliable data transmission.

Terminal Position: DUAL

Dual terminal position allows for increased flexibility in routing signals and connections, accommodating different PCB layouts.

Maximum Seated Height: 0.8 mm

The low maximum seated height minimizes the overall profile of the component on the PCB, saving space and enabling sleek designs.

Width: 3 mm

The compact width of 3mm makes this product suitable for applications where space is limited and precise placement is required.

Length: 4 mm

The short length of 4mm contributes to the overall compactness of the component, making it easier to integrate into tight layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in harsh operating conditions common in industrial settings.

Terminal Form: NO LEAD

No lead terminals are environmentally friendly and compliant with regulations, promoting sustainable manufacturing practices.

Telecom IC Type: LINE EQUALIZER

Line equalizer functionality provides signal conditioning capabilities, ensuring optimal transmission quality over telecom networks.

Nominal Supply Voltage: 2.5 V

The 2.5V nominal supply voltage is a common standard in many applications, ensuring compatibility and ease of integration.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting on the PCB, facilitating compact designs and efficient use of space.

Technical Specifications

Analog Data Transmission Interfaces DS64EV100SD attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-XDSO-N14

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

DS64EV100SD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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