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DS64EV100

Texas Instruments

DS64EV100 by Texas Instruments

DS64EV100 by Texas Instruments is a small outline, heat sink package with 14 terminals. It operates in industrial temperature range (-40 to 85 °C) and has a supply voltage of 2.5 V. Ideal for analog data transmission interfaces as a line equalizer in telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,978 parts In-Stock

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Digiode

USA . 2,989 parts In-Stock

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2,989

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Anansix

USA . 2,789 parts In-Stock

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2,789

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Distributors (Availability)

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Native Components

USA . 532 parts In-Stock

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$0.990

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532

$0.990

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Northwest PG Solutions

USA . 1,643 parts In-Stock

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$1.089

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1,643

$1.089

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Parana Technologies

USA . 1,472 parts In-Stock

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$9.391

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$10.008

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1,472

$9.391

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$10.008

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DigiPath Technology Company

USA . 2,084 parts In-Stock

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$10.341

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2,084

$10.341

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ChromeModa Solutions

Germany . 5,964 parts In-Stock

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$10.552

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$8.653

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5,964

$10.552

$8.653

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IDEA Electronic Components Group

UK . 257 parts In-Stock

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$10.552

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$10.024

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$9.497

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257

$10.552

$10.024

$9.497

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AZTECH Wire

Italy . 800 parts In-Stock

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$15.546

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800

$15.546

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One Stop Electronics

USA . 425 parts In-Stock

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$93.000

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$93.000

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Corphita

USA . 549 parts In-Stock

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549

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Overview

Upgrade your analog data transmission with the DS64EV100 by Texas Instruments. This high-quality product offers outstanding performance and reliability, backed by the trusted name of TI. Ideal for telecom applications, the DS64EV100 provides seamless line equalization with a nominal supply voltage of 2.5V. With its compact package style and industrial temperature grade, this device is a valuable asset for any project requiring precise data transmission. Experience the benefits of superior technology and innovation with the DS64EV100.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB, making this product efficient for compact designs.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and allows for easier PCB layout and placement of components, enhancing compatibility.

No. of Terminals: 14

Having 14 terminals provides flexibility in connectivity options and allows for multiple functions to be supported, making the product versatile.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enables efficient heat dissipation and space-saving design, ideal for compact applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this product suitable for use in a wide range of environments, including harsh conditions.

Terminal Position: DUAL

Dual terminal position allows for increased connectivity and functionality, making the product adaptable for various applications.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8 mm, this product offers a low profile design, facilitating compact and slim device designs.

Width: 3 mm

The width of 3 mm enables easy integration into tight spaces, making the product suitable for applications with space constraints.

Length: 4 mm

The length of 4 mm allows for a compact form factor, contributing to efficient PCB layout and space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding industrial environments, making this product suitable for rugged applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead-related issues, such as solder joint failures, ensuring long-term reliability of the product.

Telecom IC Type: LINE EQUALIZER

Being a line equalizer, this product is designed to enhance signal quality and compensate for signal loss, making it ideal for telecom applications requiring improved signal integrity.

Nominal Supply Voltage: 2.5 V

With a nominal supply voltage of 2.5 V, this product is suitable for low-power applications and can operate efficiently with lower voltage sources.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for precise and compact connections, enabling high-density PCB layouts and enhancing overall design efficiency.

Technical Specifications

Analog Data Transmission Interfaces DS64EV100 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-XDSO-N14

Length:

4 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

DS64EV100 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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