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DS64EV100SDX/NOPB

Texas Instruments

DS64EV100SDX/NOPB by Texas Instruments

DS64EV100SDX/NOPB by Texas Instruments is an Analog Data Transmission Interface with 14 terminals, operating at temperatures from -40 to 85°C. It has a small outline package style and requires power supplies of 2.5/3.3V. Ideal for telecom applications as a line equalizer IC due to its industrial temperature grade and no-lead terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,794 parts In-Stock

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7,794

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Digiode

USA . 2,222 parts In-Stock

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2,222

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Anansix

USA . 1,904 parts In-Stock

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1,904

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 680 parts In-Stock

1+ parts

$9.332

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680

$9.332

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Parana Technologies

USA . 150 parts In-Stock

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$9.826

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$10.393

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150

$9.826

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$10.393

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DigiPath Technology Company

USA . 539 parts In-Stock

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$10.819

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539

$10.819

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ChromeModa Solutions

Germany . 2,155 parts In-Stock

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$11.040

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$9.053

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2,155

$11.040

$9.053

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IDEA Electronic Components Group

UK . 757 parts In-Stock

1+ parts

$11.040

100+ parts

$10.488

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$9.936

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757

$11.040

$10.488

$9.936

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Component Stockers USA

USA . 542 parts In-Stock

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$99.990

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542

$99.990

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One Stop Electronics

USA . 1,107 parts In-Stock

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$173.000

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$173.000

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QUARKTWIN TECHNOLOGY LTD

USA . 19,706 parts In-Stock

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Microchip USA

USA . 4,902 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Corphita

USA . 1,479 parts In-Stock

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Native Components

USA . 954 parts In-Stock

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$4.608

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954

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$4.608

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Northwest PG Solutions

USA . 602 parts In-Stock

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$4.655

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602

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$4.655

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Overview

Elevate your data transmission experience with the DS64EV100SDX/NOPB by Texas Instruments. Expertly crafted by a trusted manufacturer, this analog data transmission interface offers unparalleled quality and reliability. Perfect for a wide range of applications, this device delivers seamless connectivity and high-performance results. Unlock the full potential of your projects with the exceptional value, benefits, and advantages that the DS64EV100SDX/NOPB brings to the table. Experience innovation at its finest with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the interface, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability makes installation easier and more convenient, especially in compact electronic devices.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows flexibility in integration with different systems or devices.

No. of Terminals: 14

Having 14 terminals provides sufficient connectivity options for various input and output signals.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh or demanding environments.

Terminal Finish: MATTE TIN

Matte Tin finish on terminals offers good conductivity and corrosion resistance for stable signal transmission.

Terminal Position: DUAL

Dual terminal positions provide flexibility in connection options, accommodating different wiring configurations.

Width: 3 mm

Compact width makes this interface suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures performance and reliability in challenging industrial environments.

Nominal Supply Voltage: 2.5 V

Stable supply voltage of 2.5 V ensures consistent and reliable operation of the interface.

Technical Specifications

Analog Data Transmission Interfaces DS64EV100SDX/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-N14

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC14,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

DS64EV100SDX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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