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L3845

STMicroelectronics

L3845 by STMicroelectronics

STMicroelectronics L3845 is an Analog Data Transmission Interface with 8 terminals, operating at -40 to 70 °C. It has a supply voltage of 20V and uses Tin/Lead finish. The rectangular package style makes it suitable for various applications in electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,335 parts In-Stock

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4,335

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Vyrian

USA . 3,731 parts In-Stock

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3,731

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Anansix

USA . 1,393 parts In-Stock

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1,393

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Corel Iberica Componentes, S.L.

Spain . 1,180 parts In-Stock

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1,180

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ComSIT Distribution GmbH

Germany . 80 parts In-Stock

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80

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Prism Electronics

USA . 15 parts In-Stock

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15

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ECAB

Sweden . 15 parts In-Stock

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15

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,135 parts In-Stock

1+ parts

$13.991

100+ parts

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$12.592

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$13.991

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$12.592

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MKK Technologies

India . 1,230 parts In-Stock

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$26.310

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$26.310

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DigiPath Technology Company

USA . 1,230 parts In-Stock

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$26.310

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$26.310

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A-Z Elektronik GmbH

Germany . 5,634 parts In-Stock

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5,634

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Alle Elektronik GmbH

Germany . 3,756 parts In-Stock

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3,756

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Corphita

USA . 2,026 parts In-Stock

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ChipstoGo Electronic ltd

UK . 1,297 parts In-Stock

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Assy Fe

Spain . 1,180 parts In-Stock

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Parana Technologies

USA . 587 parts In-Stock

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$16.729

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587

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$16.729

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Perfect Parts

USA . 17 parts In-Stock

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Overview

Elevate your data transmission experience with the L3845 by STMicroelectronics. Crafted with precision and expertise, this analog interface device guarantees top-notch quality and reliability for your applications. Seamlessly connect and transmit data with ease, thanks to its innovative design and advanced technology. Say goodbye to compatibility issues and hello to seamless communication. Trust in STMicroelectronics to deliver exceptional performance and value with the L3845. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package durable and resistant to environmental factors, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and installation in various electronic systems and devices.

Power Supplies (V): 20

Provides a stable power supply of 20 volts, suitable for many applications requiring higher voltage levels.

No. of Terminals: 8

Eight terminals offer flexibility in connection options and support for multiple data transmission channels.

Package Style (Meter): IN-LINE

In-line package style allows for space-saving installation and organized wiring arrangements in systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high-temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Can operate efficiently in low-temperature conditions down to -40 °C, making it suitable for a wide range of environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish ensures good conductivity and reliability in data transmission, preventing signal loss or interference.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures a secure connection, reducing the risk of signal disruptions or data loss.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and secure mounting on PCBs, ensuring stable connections and long-lasting performance.

Nominal Supply Voltage: 20 V

A nominal supply voltage of 20 volts ensures compatibility with a wide range of electronic devices and systems requiring this voltage level.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54 mm enables easy connectivity and compatibility with standard electronic components and PCB layouts.

Technical Specifications

Analog Data Transmission Interfaces L3845 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

20

Qualification:

Not Qualified

Sub-Category:

Analog Transmission Interfaces

Nominal Supply Voltage:

20 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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