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DS32EV100

Texas Instruments

DS32EV100 by Texas Instruments

DS32EV100 by Texas Instruments is a line equalizer IC with 14 terminals, operating from -40 to 85°C. It features a small outline package style and is suitable for analog data transmission interfaces in industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,968 parts In-Stock

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5,968

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Digiode

USA . 2,651 parts In-Stock

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Anansix

USA . 2,295 parts In-Stock

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2,295

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Distributors (Availability)

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Native Components

USA . 596 parts In-Stock

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$0.188

100+ parts

-

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$0.181

596

$0.188

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$0.181

Northwest PG Solutions

USA . 1,043 parts In-Stock

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$0.207

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$0.183

1,043

$0.207

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$0.183

AZTECH Wire

Italy . 873 parts In-Stock

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$9.987

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873

$9.987

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Parana Technologies

USA . 1,882 parts In-Stock

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$10.401

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$10.914

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1,882

$10.401

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$10.914

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ChromeModa Solutions

Germany . 4,916 parts In-Stock

1+ parts

$11.686

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$9.583

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4,916

$11.686

$9.583

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IDEA Electronic Components Group

UK . 2,364 parts In-Stock

1+ parts

$11.686

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$11.102

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$10.517

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2,364

$11.686

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$10.517

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One Stop Electronics

USA . 1,317 parts In-Stock

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$967.000

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1,317

$967.000

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DigiPath Technology Company

USA . 667 parts In-Stock

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$10.536

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667

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Corphita

USA . 434 parts In-Stock

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434

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Overview

Unleash the power of reliable data transmission with the DS32EV100 from Texas Instruments. As a leading manufacturer in analog data transmission interfaces, Texas Instruments delivers top-quality products that guarantee seamless connectivity and unrivaled performance. Whether you're in telecommunications, networking, or industrial applications, the DS32EV100 offers unparalleled value and benefits. Say goodbye to transmission issues and hello to efficient and effective data transfer with this innovative solution. Trust Texas Instruments to provide you with the tools you need to stay connected and ahead of the curve.

Feature Benefit Bullets

Surface Mount: yes

Surface mount capability allows for easy and secure installation on circuit boards, reducing assembly time and ensuring a reliable connection.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 14

A higher number of terminals provide flexibility in connecting to other components, allowing for versatile circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can withstand challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable performance even in cold environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity, making the product suitable for critical applications.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for a slim profile and space-saving design in compact electronic devices.

Width: 3 mm

Narrow width makes the product suitable for applications where space is limited or where multiple components need to be installed side by side.

Length: 4 mm

Short length helps in compact circuit board designs and reduces the overall footprint of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh industrial environments, making it reliable for industrial applications.

Terminal Form: NO LEAD

No lead terminal form complies with RoHS regulations and minimizes environmental impact, making it an eco-friendly choice.

Telecom IC Type: LINE EQUALIZER

Line equalizer functionality helps in maintaining signal quality over long-distance communication lines, making the product ideal for telecommunications applications.

Nominal Supply Voltage: 2.5 V

Low nominal supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense packing of terminals on the circuit board, enabling high-density designs in limited space.

Technical Specifications

Analog Data Transmission Interfaces DS32EV100 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-XDSO-N14

Length:

4 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

DS32EV100 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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