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DS32EV400SQX/NOPB

Texas Instruments

DS32EV400SQX/NOPB by Texas Instruments

DS32EV400SQX/NOPB by Texas Instruments is a 48-terminal analog data transmission interface with power supplies of 2.5/3.3V, suitable for telecom applications as a line equalizer. It operates in industrial temperature range (-40 to 85°C) and features a square package style with matte tin terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,952 parts In-Stock

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Digiode

USA . 2,864 parts In-Stock

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Anansix

USA . 507 parts In-Stock

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507

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 662 parts In-Stock

1+ parts

$0.496

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662

$0.496

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Northwest PG Solutions

USA . 8 parts In-Stock

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$0.546

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$0.481

8

$0.546

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$0.481

AZTECH Wire

Italy . 251 parts In-Stock

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$11.110

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251

$11.110

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Parana Technologies

USA . 2,081 parts In-Stock

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$15.970

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$16.316

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2,081

$15.970

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$16.316

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ChromeModa Solutions

Germany . 5,930 parts In-Stock

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$17.944

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$14.714

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5,930

$17.944

$14.714

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IDEA Electronic Components Group

UK . 1,868 parts In-Stock

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$17.944

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$17.047

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$16.150

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1,868

$17.944

$17.047

$16.150

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One Stop Electronics

USA . 403 parts In-Stock

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$266.000

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403

$266.000

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QUARKTWIN TECHNOLOGY LTD

USA . 27,642 parts In-Stock

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Corphita

USA . 4,419 parts In-Stock

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Microchip USA

USA . 4,214 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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DigiPath Technology Company

USA . 1,498 parts In-Stock

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$16.178

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1,498

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$16.178

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Overview

Enhance your analog data transmission interfaces with the Texas Instruments DS32EV400SQX/NOPB. Known for their superior quality and reliability, Texas Instruments offers a cutting-edge solution that delivers exceptional performance in industrial settings. Ideal for line equalizer applications, this product ensures seamless connectivity and efficiency. With its compact square package design and wide operating temperature range, the DS32EV400SQX/NOPB is a valuable asset for customers seeking high-quality solutions for their communication needs. Upgrade your systems today with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space in electronic designs.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the circuit board and provides a uniform layout for better organization during assembly.

Power Supplies (V): 2.5/3.3

Support for multiple power supply options (2.5V/3.3V) makes the product versatile and compatible with various systems and applications.

No. of Terminals: 48

Having 48 terminals allows for multiple connections and functions to be supported by the product, enabling complex signal processing and data transmission capabilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options provide flexibility in thermal management and footprint size, catering to different design requirements and constraints.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability of the product even under harsh operating conditions, making it suitable for industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and electrical conductivity for terminal connections, ensuring reliable performance and durability.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and connection of signals, enhancing signal integrity and performance of the product.

Width: 7 mm

Compact width design helps in space-saving on the circuit board, enabling dense packing of components for efficient use of PCB real estate.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has a moderate sensitivity to moisture, which is important for reliability in humid environments or during assembly processes.

Technical Specifications

Analog Data Transmission Interfaces DS32EV400SQX/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DS32EV400SQX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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