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DS32EV100SD/NOPB

Texas Instruments

DS32EV100SD/NOPB by Texas Instruments

DS32EV100SD/NOPB by Texas Instruments is an Analog Data Transmission Interface with 14 terminals, operating at -40 to 85°C. It features a small outline package style, matte tin finish, and dual terminal position. Ideal for telecom applications requiring line equalization at a nominal voltage of 2.5V.

Median Price

$4.760

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 47,787 parts In-Stock

1+ parts

$4.760

100+ parts

$3.881

1k+ parts

$2.587

10k+ parts

-

47,787

$4.760

$3.881

$2.587

-

DigiKey

USA . 597 parts In-Stock

1+ parts

$7.000

100+ parts

$4.555

1k+ parts

$4.114

10k+ parts

$4.028

597

$7.000

$4.555

$4.114

$4.028

Mouser Electronics

USA . 94 parts In-Stock

1+ parts

$7.000

100+ parts

$4.560

1k+ parts

$4.110

10k+ parts

-

94

$7.000

$4.560

$4.110

-

Rochester

USA . 4,365 parts In-Stock

1+ parts

-

100+ parts

$3.730

1k+ parts

$3.340

10k+ parts

$3.140

4,365

-

$3.730

$3.340

$3.140

Verical

USA . 4,365 parts In-Stock

1+ parts

-

100+ parts

$4.662

1k+ parts

$4.175

10k+ parts

$3.925

4,365

-

$4.662

$4.175

$3.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,122 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

-

10k+ parts

-

4,122

$3.410

-

-

-

Vyrian

USA . 4,649 parts In-Stock

1+ parts

$3.590

100+ parts

-

1k+ parts

-

10k+ parts

-

4,649

$3.590

-

-

-

Anansix

USA . 1,499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,499

-

-

-

-

Speed Components Ltd

Israel . 24 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,180 parts In-Stock

1+ parts

$3.231

100+ parts

-

1k+ parts

-

10k+ parts

-

4,180

$3.231

-

-

-

Native Components

USA . 373 parts In-Stock

1+ parts

$5.132

100+ parts

-

1k+ parts

-

10k+ parts

-

373

$5.132

-

-

-

Parana Technologies

USA . 1,115 parts In-Stock

1+ parts

$6.164

100+ parts

-

1k+ parts

$6.933

10k+ parts

-

1,115

$6.164

-

$6.933

-

DigiPath Technology Company

USA . 1,718 parts In-Stock

1+ parts

$6.787

100+ parts

-

1k+ parts

-

10k+ parts

-

1,718

$6.787

-

-

-

ChromeModa Solutions

Germany . 3,570 parts In-Stock

1+ parts

$6.926

100+ parts

$5.679

1k+ parts

-

10k+ parts

-

3,570

$6.926

$5.679

-

-

IDEA Electronic Components Group

UK . 327 parts In-Stock

1+ parts

$6.926

100+ parts

-

1k+ parts

$6.233

10k+ parts

-

327

$6.926

-

$6.233

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,097 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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26,097

-

-

-

-

iodParts Technologies Inc.

India . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,000

-

-

-

-

Northwest PG Solutions

USA . 1,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.029

10k+ parts

-

1,253

-

-

$5.029

-

Perfect Parts

USA . 952 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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952

-

-

-

-

Overview

Unlock seamless data transmission with the Texas Instruments DS32EV100SD/NOPB. Crafted with precision and expertise, this analog interface device guarantees unparalleled quality and reliability. Designed for industrial applications, this product offers a compact and efficient solution for your communication needs. Experience the value of seamless connectivity and enhanced performance with the DS32EV100SD/NOPB by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Power Supplies (V): 2.5/3.3

The ability to operate at both 2.5V and 3.3V power supplies offers flexibility in different voltage requirements for various systems.

No. of Terminals: 14

With 14 terminals, this product supports multiple connectivity options and interfaces, making it versatile for different communication needs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enables the product to function effectively in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and conductivity, enhancing the product's overall performance and reliability.

Terminal Position: DUAL

Dual terminal position allows for secure connections and better signal transmission, ensuring stable and reliable data transmission.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8 mm helps to minimize the overall profile of the product, making it suitable for compact designs and space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh environmental conditions, making it suitable for industrial applications.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and RoHS compliant, making the product a sustainable choice for modern electronic applications.

Technical Specifications

Analog Data Transmission Interfaces DS32EV100SD/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-N14

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC14,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

DS32EV100SD/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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