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DS32EV400SQX

Texas Instruments

DS32EV400SQX by Texas Instruments

DS32EV400SQX by Texas Instruments is a 48-terminal analog data transmission interface with a square package shape. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 2.5V. Ideal for telecom applications as a line equalizer IC due to its compact size and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,799 parts In-Stock

1+ parts

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2,799

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Anansix

USA . 2,744 parts In-Stock

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2,744

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Digiode

USA . 555 parts In-Stock

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555

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$5.556

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275

$5.556

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Parana Technologies

USA . 1,316 parts In-Stock

1+ parts

$12.327

100+ parts

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$12.758

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1,316

$12.327

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$12.758

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DigiPath Technology Company

USA . 2,173 parts In-Stock

1+ parts

$13.574

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2,173

$13.574

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ChromeModa Solutions

Germany . 3,747 parts In-Stock

1+ parts

$13.851

100+ parts

$11.358

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3,747

$13.851

$11.358

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IDEA Electronic Components Group

UK . 1,039 parts In-Stock

1+ parts

$13.851

100+ parts

$13.158

1k+ parts

$12.466

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1,039

$13.851

$13.158

$12.466

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Native Components

USA . 88 parts In-Stock

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$14.350

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88

$14.350

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Northwest PG Solutions

USA . 2,247 parts In-Stock

1+ parts

$15.785

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$14.207

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2,247

$15.785

$14.207

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One Stop Electronics

USA . 1,425 parts In-Stock

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$470.000

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1,425

$470.000

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Corphita

USA . 2,986 parts In-Stock

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2,986

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Overview

Elevate your analog data transmission with the DS32EV400SQX by Texas Instruments. This cutting-edge Telecom IC type line equalizer boasts top-notch quality and reliability, thanks to its manufacturer's stellar reputation. Ideal for a wide range of applications, this surface-mount chip carrier offers exceptional value with its industrial-grade temperature grade, compact square package, and innovative features. Stay ahead of the curve and experience seamless communication with the DS32EV400SQX.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient and reliable PCB assembly, making this product easy to integrate into various electronic systems.

Package Shape: SQUARE

The square package shape helps in efficient use of board space and allows for compact design of the product.

No. of Terminals: 48

With a high number of terminals, this product offers versatility in connectivity options and can accommodate multiple input and output channels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand challenging environmental conditions and maintain performance in industrial settings.

Nominal Supply Voltage: 2.5 V

The 2.5V supply voltage requirement makes this product suitable for a wide range of applications and compatible with common power sources.

Technical Specifications

Analog Data Transmission Interfaces DS32EV400SQX attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DS32EV400SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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