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LMH0394SQ

Texas Instruments

LMH0394SQ by Texas Instruments

Texas Instruments LMH0394SQ is a 16-terminal analog data transmission interface in square chip carrier package. It features line equalizer for telecom applications. Surface mountable, quad terminal position with no lead form makes it ideal for high-speed signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,755

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-

-

-

Digiode

USA . 1,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,999

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-

-

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Anansix

USA . 1,822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,822

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 432 parts In-Stock

1+ parts

$14.999

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$14.999

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-

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Parana Technologies

USA . 2,106 parts In-Stock

1+ parts

$15.139

100+ parts

-

1k+ parts

$15.544

10k+ parts

-

2,106

$15.139

-

$15.544

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ChromeModa Solutions

Germany . 6,192 parts In-Stock

1+ parts

$17.010

100+ parts

$13.948

1k+ parts

-

10k+ parts

-

6,192

$17.010

$13.948

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IDEA Electronic Components Group

UK . 1,158 parts In-Stock

1+ parts

$17.010

100+ parts

$16.160

1k+ parts

$15.309

10k+ parts

-

1,158

$17.010

$16.160

$15.309

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One Stop Electronics

USA . 1,503 parts In-Stock

1+ parts

$201.000

100+ parts

-

1k+ parts

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10k+ parts

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1,503

$201.000

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Corphita

USA . 2,524 parts In-Stock

1+ parts

-

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2,524

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DigiPath Technology Company

USA . 461 parts In-Stock

1+ parts

-

100+ parts

$15.336

1k+ parts

-

10k+ parts

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461

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$15.336

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Overview

Experience unparalleled quality and performance with the LMH0394SQ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Analog Data Transmission Interfaces like this one. Perfect for telecom applications, this LINE EQUALIZER offers customers exceptional value and benefits. With its surface mount capability and compact square package shape, the LMH0394SQ provides reliability and efficiency in a variety of settings. Trust Texas Instruments for cutting-edge solutions that elevate your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design makes installation easy and convenient, allowing for more compact and efficient layout on circuit boards.

Package Shape: SQUARE

Square package shape provides stability and even distribution of components, ensuring reliability in operation.

No. of Terminals: 16

Having 16 terminals allows for versatile connections and configurations, enhancing the adaptability of the product.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers efficient heat dissipation and protection for the components, increasing the product's durability.

Terminal Position: QUAD

Quad terminal position enables easy connection to multiple devices, facilitating seamless integration into various systems.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of short circuits and improves the overall reliability of the product.

Telecom IC Type: LINE EQUALIZER

Line equalizer telecom IC type ensures optimal signal quality transmission over long distances, making it ideal for telecom applications.

Technical Specifications

Analog Data Transmission Interfaces LMH0394SQ attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

No. of Terminals:

16

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

LMH0394SQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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