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DS30EA101SQ

Texas Instruments

DS30EA101SQ by Texas Instruments

DS30EA101SQ by Texas Instruments is a 16-terminal analog data transmission interface with a square package shape. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of 2.5 V. Ideal for telecom applications as a line equalizer, this chip carrier features no-lead terminal form and very thin profile package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,599 parts In-Stock

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Bristol Electronics

USA . 1,400 parts In-Stock

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1,400

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Digiode

USA . 449 parts In-Stock

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449

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AZTECH Wire

Italy . 497 parts In-Stock

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$11.730

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497

$11.730

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Parana Technologies

USA . 262 parts In-Stock

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$11.732

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$12.128

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262

$11.732

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$12.128

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DigiPath Technology Company

USA . 586 parts In-Stock

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$12.918

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$11.885

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586

$12.918

$11.885

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ChromeModa Solutions

Germany . 2,659 parts In-Stock

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$13.182

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$10.809

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$13.182

$10.809

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IDEA Electronic Components Group

UK . 644 parts In-Stock

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$13.182

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$12.523

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$11.864

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644

$13.182

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One Stop Electronics

USA . 879 parts In-Stock

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$625.000

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Corphita

USA . 1,421 parts In-Stock

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Northwest PG Solutions

USA . 1,337 parts In-Stock

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Kepictronics

USA . 546 parts In-Stock

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Native Components

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Overview

Unlock the power of seamless analog data transmission with the DS30EA101SQ by Texas Instruments. This innovative line equalizer offers unparalleled quality and reliability, meeting industrial-grade standards for temperature and performance. With its compact square package shape and surface mount design, this chip carrier is perfect for a wide range of applications. Experience the value of enhanced signal integrity and improved data communication with this cutting-edge solution from a trusted industry leader. Elevate your projects with the DS30EA101SQ and discover the difference that Texas Instruments can make for your analog data transmission needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making this product suitable for high-volume production.

Package Shape: SQUARE

Square package shape provides good stability and alignment, ensuring reliability in operation.

No. of Terminals: 16

With 16 terminals, this product offers a wide range of connectivity options for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and a very thin profile design enhances thermal management and overall efficiency of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can perform reliably even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures that the product can function in extreme cold conditions as well.

Terminal Position: QUAD

Quad terminal position enables efficient signal transmission and connectivity, enhancing the overall performance of the product.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a compact design and easy integration in space-constrained applications.

Width: 4 mm

The compact width of 4mm makes this product suitable for applications where space is limited.

Length: 4 mm

The small length of 4mm further enhances the compact form factor of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's reliability and performance in harsh industrial environments.

Terminal Form: NO LEAD

The lead-free terminal form is environmentally friendly and complies with regulations, making it a sustainable choice for applications.

Telecom IC Type: LINE EQUALIZER

The line equalizer IC type enables precise adjustment of signal levels, ensuring optimal signal quality in telecommunications applications.

Nominal Supply Voltage: 2.5 V

The 2.5V nominal supply voltage is compatible with a wide range of systems and power sources, enhancing the product's flexibility.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting, making this product suitable for applications requiring compact designs.

Technical Specifications

Analog Data Transmission Interfaces DS30EA101SQ attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

DS30EA101SQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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