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DS30EA101SQE

Texas Instruments

DS30EA101SQE by Texas Instruments

DS30EA101SQE by Texas Instruments is a 16-terminal analog data transmission interface with a square package shape. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of 2.5 V. Ideal for telecom applications as a line equalizer IC due to its compact size and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,631 parts In-Stock

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Digiode

USA . 4,921 parts In-Stock

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Bristol Electronics

USA . 1,400 parts In-Stock

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1,400

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Distributors (Availability)

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Native Components

USA . 976 parts In-Stock

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$5.220

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976

$5.220

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AZTECH Wire

Italy . 228 parts In-Stock

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$5.414

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228

$5.414

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Parana Technologies

USA . 1,090 parts In-Stock

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$11.477

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$11.891

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1,090

$11.477

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$11.891

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ChromeModa Solutions

Germany . 6,577 parts In-Stock

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$12.896

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$10.575

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6,577

$12.896

$10.575

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IDEA Electronic Components Group

UK . 1,200 parts In-Stock

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$12.896

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$12.251

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$11.606

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$12.896

$12.251

$11.606

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Ampacity Inc.

Singapore . 501 parts In-Stock

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$138.000

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501

$138.000

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One Stop Electronics

USA . 292 parts In-Stock

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$528.000

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292

$528.000

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Semicontronic

India . 336 parts In-Stock

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$1,000.000

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$975.000

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$970.000

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336

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Lixinc

USA . 14,955 parts In-Stock

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DigiPath Technology Company

USA . 1,595 parts In-Stock

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$11.627

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Kepictronics

USA . 1,330 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Northwest PG Solutions

USA . 935 parts In-Stock

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$5.116

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935

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$5.116

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Corphita

USA . 690 parts In-Stock

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Corohmni

South Africa . 500 parts In-Stock

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Overview

Elevate your data transmission experience with the DS30EA101SQE from Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments delivers top-notch analog data transmission interfaces that redefine connectivity. Whether you're in telecommunications or industrial applications, this square package chip carrier with a very thin profile offers unmatched value and benefits. Say goodbye to signal loss and hello to seamless communication with the DS30EA101SQE.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy installation and integration into PCBs, saving time and effort in assembly.

Package Shape: SQUARE

Square package shape provides a compact design, making it ideal for applications where space is limited.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and makes the product suitable for a variety of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can operate reliably in a wide range of environments without overheating.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures the product can function effectively even in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position enables secure and stable connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for a slim profile, making it suitable for compact devices or applications with space constraints.

Width: 4 mm

Compact width dimension ensures the product can be easily integrated into tight spaces or PCB layouts.

Length: 4 mm

The small length dimension contributes to the overall compact design of the product, making it a good choice for space-sensitive applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and durability in harsh industrial environments, making it a robust choice for industrial applications.

Terminal Form: NO LEAD

No-lead terminal form provides a lead-free and environmentally friendly option, adhering to RoHS compliance standards.

Telecom IC Type: LINE EQUALIZER

Line equalizer function helps in maintaining signal integrity and quality over long-distance transmissions, making it suitable for telecom applications.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5 V ensures compatibility with standard power sources, simplifying integration into existing systems or designs.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm allows for precise and secure connections, enhancing the overall performance and reliability of the product.

Technical Specifications

Analog Data Transmission Interfaces DS30EA101SQE attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

DS30EA101SQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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