Loading...

DS30EA101SQ/NOPB

Texas Instruments

DS30EA101SQ/NOPB by Texas Instruments

DS30EA101SQ/NOPB by Texas Instruments is a 16-terminal analog data transmission interface with a supply voltage of 2.5V and max operating temperature of 85°C. It features a line equalizer for telecom applications, NO LEAD terminal form, and INDUSTRIAL temperature grade suitability.

Median Price

$12.764

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,918 parts In-Stock

1+ parts

$12.252

100+ parts

$10.702

1k+ parts

$7.381

10k+ parts

-

19,918

$12.252

$10.702

$7.381

-

Mouser Electronics

USA . 1,262 parts In-Stock

1+ parts

$18.150

100+ parts

$12.480

1k+ parts

$11.470

10k+ parts

-

1,262

$18.150

$12.480

$11.470

-

Rochester

USA . 3,265 parts In-Stock

1+ parts

-

100+ parts

$10.620

1k+ parts

$9.500

10k+ parts

$8.940

3,265

-

$10.620

$9.500

$8.940

DigiKey

USA . 3,265 parts In-Stock

1+ parts

-

100+ parts

$13.980

1k+ parts

-

10k+ parts

-

3,265

-

$13.980

-

-

Verical

USA . 2,655 parts In-Stock

1+ parts

-

100+ parts

$13.275

1k+ parts

$11.875

10k+ parts

$11.175

2,655

-

$13.275

$11.875

$11.175

Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.120

10k+ parts

-

1,000

-

-

$8.120

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 681 parts In-Stock

1+ parts

$9.738

100+ parts

-

1k+ parts

-

10k+ parts

-

681

$9.738

-

-

-

Vyrian

USA . 1,734 parts In-Stock

1+ parts

$10.250

100+ parts

-

1k+ parts

-

10k+ parts

-

1,734

$10.250

-

-

-

Chip Stock

USA . 6,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,567

-

-

-

-

Bristol Electronics

USA . 1,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,502 parts In-Stock

1+ parts

$9.225

100+ parts

-

1k+ parts

-

10k+ parts

-

4,502

$9.225

-

-

-

Parana Technologies

USA . 639 parts In-Stock

1+ parts

$10.554

100+ parts

-

1k+ parts

$11.056

10k+ parts

-

639

$10.554

-

$11.056

-

DigiPath Technology Company

USA . 2,002 parts In-Stock

1+ parts

$11.621

100+ parts

-

1k+ parts

-

10k+ parts

-

2,002

$11.621

-

-

-

ChromeModa Solutions

Germany . 6,103 parts In-Stock

1+ parts

$11.858

100+ parts

$9.724

1k+ parts

-

10k+ parts

-

6,103

$11.858

$9.724

-

-

IDEA Electronic Components Group

UK . 1,760 parts In-Stock

1+ parts

$11.858

100+ parts

$11.265

1k+ parts

$10.672

10k+ parts

-

1,760

$11.858

$11.265

$10.672

-

A-Z Elektronik GmbH

Germany . 6,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,464

-

-

-

-

Alle Elektronik GmbH

Germany . 4,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,309

-

-

-

-

Native Components

USA . 369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.477

10k+ parts

-

369

-

-

$3.477

-

Authorized Procurement Solutions

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Northwest PG Solutions

USA . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.513

10k+ parts

-

12

-

-

$3.513

-

Overview

Unlock seamless data transmission with the DS30EA101SQ/NOPB by Texas Instruments. As a leading manufacturer in analog data transmission interfaces, Texas Instruments guarantees top-notch quality and reliability. Ideal for various applications, this square-shaped chip carrier boasts a very thin profile and matte tin terminal finish for efficient performance. With a nominal supply voltage of 3.1V and low supply current of 0.065mA, customers can trust in the value and benefits this line equalizer offers. Experience industrial-grade excellence with Texas Instruments' innovative solution.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and compact installation on PCBs, saving space and simplifying assembly process.

Package Shape: SQUARE

Square package shape provides a stable and efficient form factor for mounting and electromagnetic compatibility.

Power Supplies (V): 2.5

Low power supply requirement of 2.5V enables energy-efficient operation and compatibility with a wide range of systems.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functions to be supported, increasing versatility and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Package style with chip carrier, heat sink/slug, and very thin profile ensures optimal performance, heat dissipation, and space-saving qualities.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliability and durability under challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for usage in extreme cold environments without performance degradation.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and solderability, enhancing the product's longevity and reliability.

Terminal Position: QUAD

Quad terminal position offers stable and secure connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 0.8 mm

Low maximum seated height of 0.8mm enables a compact design, ideal for space-constrained applications and PCB layouts.

Width: 4 mm

Narrow width of 4mm allows for efficient use of board space and easy integration into existing systems.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature of 30 seconds ensures quick and reliable soldering during assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C enables robust solder joints and secure connections for long-term performance.

Length: 4 mm

Compact length of 4mm complements the square package shape for a balanced and space-efficient design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures reliable operation in harsh industrial environments with varying temperature conditions.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with regulations, making the product suitable for green initiatives.

Maximum Supply Current: 0.065 mA

Low maximum supply current of 0.065mA results in minimal power consumption and efficiency in operation.

Telecom IC Type: LINE EQUALIZER

Line equalizer telecom IC type enhances signal quality and stability, making it suitable for telecommunications applications requiring precise signal transmission.

Nominal Supply Voltage: 3.1 V

Nominal supply voltage of 3.1V ensures compatibility with standard power sources and efficient performance.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for precise connections and signal transmission, ideal for high-frequency applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product can withstand moderate exposure to humidity and moisture, increasing reliability in various environmental conditions.

Technical Specifications

Analog Data Transmission Interfaces DS30EA101SQ/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.065 mA

Nominal Supply Voltage:

3.1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

DS30EA101SQ/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 5