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TDB7722

STMicroelectronics

TDB7722 by STMicroelectronics

TDB7722 by STMicroelectronics is an Analog Data Transmission Interface with +-5V power supplies, 15 terminals, and 70 °C max operating temp. It is used in SLIC telecom ICs for -30 to -72V battery supply applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,746 parts In-Stock

1+ parts

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1,746

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Anansix

USA . 1,257 parts In-Stock

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1,257

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ECAB

Sweden . 909 parts In-Stock

1+ parts

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909

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Vyrian

USA . 563 parts In-Stock

1+ parts

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563

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,966 parts In-Stock

1+ parts

$9.040

100+ parts

-

1k+ parts

$8.136

10k+ parts

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1,966

$9.040

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$8.136

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MKK Technologies

India . 2,361 parts In-Stock

1+ parts

$16.999

100+ parts

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2,361

$16.999

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DigiPath Technology Company

USA . 2,361 parts In-Stock

1+ parts

$16.999

100+ parts

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2,361

$16.999

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Corphita

USA . 4,554 parts In-Stock

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4,554

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Parana Technologies

USA . 1,645 parts In-Stock

1+ parts

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100+ parts

$10.809

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1,645

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$10.809

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Overview

Experience seamless analog data transmission with the TDB7722 by STMicroelectronics. Crafted with precision using high-quality materials, this product offers reliability and efficiency in various applications. From telecommunications to industrial automation, the TDB7722 delivers unparalleled performance, making it a valuable addition to any project. Trust in the expertise of STMicroelectronics to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Elevate your designs with the TDB7722 and unlock endless possibilities in data transmission.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various environments

Power Supplies (V): +-5

Wide power supply range allows for flexibility in system integration

No. of Terminals: 15

Sufficient terminals for connecting multiple components

Maximum Operating Temperature: 70 °C

Can operate in high temperature environments without issue

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments without issue

Minimum Power Supply Rejection Ratio (PSRR): 20 dB

Good rejection of power supply noise for clean signal transmission

Technology: BIPOLAR

Reliable technology known for its stability and performance

Nominal Negative Supply Voltage: -5 V

Allows for bi-directional power supply operation

Terminal Form: THROUGH-HOLE

Ease of soldering and strong mechanical connection

Telecom IC Type: SLIC

Specifically designed for telecom applications, ensuring optimal performance

Technical Specifications

Analog Data Transmission Interfaces TDB7722 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from STMicroelectronics

Specs

Battery Feed:

RESISTIVE

Battery Supply (V):

-30 TO -72

Hybrid:

2-4 CONVERSION

JESD-30 Code:

R-PZIP-T15

JESD-609 Code:

e0

Nominal Negative Supply Voltage:

-5 V

No. of Terminals:

15

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Power Supply Rejection Ratio (PSRR):

20 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP15,.2,.17TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

24 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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