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L3037FNTR

STMicroelectronics

L3037FNTR by STMicroelectronics

STMicroelectronics L3037FNTR is a 44-terminal analog data transmission interface in a square chip carrier package. Operating b/w 0 °C to 70°C, it has a nominal voltage of 5V and max seated height of 4.57mm. Ideal for telecom applications requiring SLIC technology with -5V negative supply voltage support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,817 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,817

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Vyrian

USA . 1,971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,971

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Extreme Components

USA . 432 parts In-Stock

1+ parts

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100+ parts

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432

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Anansix

USA . 326 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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326

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,935 parts In-Stock

1+ parts

$9.109

100+ parts

-

1k+ parts

$8.198

10k+ parts

-

1,935

$9.109

-

$8.198

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MKK Technologies

India . 757 parts In-Stock

1+ parts

$17.129

100+ parts

-

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10k+ parts

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757

$17.129

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DigiPath Technology Company

USA . 757 parts In-Stock

1+ parts

$17.129

100+ parts

-

1k+ parts

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10k+ parts

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757

$17.129

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-

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Parana Technologies

USA . 909 parts In-Stock

1+ parts

-

100+ parts

$10.891

1k+ parts

-

10k+ parts

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909

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$10.891

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Corphita

USA . 803 parts In-Stock

1+ parts

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100+ parts

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803

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Overview

Elevate your analog data transmission interfaces with the L3037FNTR by STMicroelectronics. Crafted with precision and quality in mind, this product offers unmatched reliability and performance. From its innovative design to its seamless integration, this chip carrier package delivers exceptional value to customers across various applications. Experience the benefits of superior technology and advanced features that set this telecom IC type apart from the rest. Trust in STMicroelectronics for all your interface needs and discover the advantages of the L3037FNTR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the product.

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Package Shape: SQUARE

Allows for a compact design and space-saving installation.

No. of Terminals: 44

Offers a sufficient number of connection points for various applications.

Package Style (Meter): CHIP CARRIER

Enhances thermal performance and reliability of the product.

Maximum Operating Temperature: 70 °C

Ensures stable performance even in relatively high-temperature environments.

Minimum Operating Temperature: 0 °C

Suitable for a wide range of operating conditions, from room temperature to cooler environments.

Terminal Position: QUAD

Facilitates easier connection and compatibility with standard circuit board layouts.

Maximum Seated Height: 4.57 mm

Contributes to the overall compactness of the product installation.

Width: 16.5862 mm

Provides a balanced size for the product's form factor.

Length: 16.5862 mm

Maintains a square shape for consistent design aesthetics and efficient placement.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Technology: BIPOLAR

Offers high-speed performance and reliability in signal transmission.

Nominal Negative Supply Voltage: -5 V

Provides flexibility in power supply options for the product.

Terminal Form: J BEND

Facilitates easier PCB assembly and soldering processes.

Maximum Supply Current: 10 mA

Ensures low power consumption for energy-efficient operation.

Telecom IC Type: SLIC

Specifically designed for telecom applications, ensuring reliable signal transmission.

Nominal Supply Voltage: 5 V

Standard voltage requirement for compatibility with various systems and components.

Terminal Pitch: 1.27 mm

Standard spacing for easy connection to standard PCB layouts.

Technical Specifications

Analog Data Transmission Interfaces L3037FNTR attributes and parameters. Explore more Analog Data Transmission Interfaces devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

L3037FNTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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