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LMH0395SQ/NOPB

Texas Instruments

LMH0395SQ/NOPB by Texas Instruments

LMH0395SQ/NOPB by Texas Instruments is a LINE EQUALIZER with 2970 Mbps data rate, operating at 2.5V supply voltage. This analog interface IC has a package style of CHIP CARRIER and is suitable for telecom applications due to its industrial temperature grade and quad terminal position.

Median Price

$22.114

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$12.340

100+ parts

-

1k+ parts

-

10k+ parts

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3

$12.340

-

-

-

Verical

USA . 3 parts In-Stock

1+ parts

$12.340

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$12.340

-

-

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Texas Instruments

USA . 24,688 parts In-Stock

1+ parts

$25.747

100+ parts

$22.886

1k+ parts

$16.828

10k+ parts

-

24,688

$25.747

$22.886

$16.828

-

DigiKey

USA . 978 parts In-Stock

1+ parts

$38.110

100+ parts

$27.319

1k+ parts

$25.377

10k+ parts

-

978

$38.110

$27.319

$25.377

-

Mouser Electronics

USA . 204 parts In-Stock

1+ parts

$38.110

100+ parts

$27.320

1k+ parts

$25.370

10k+ parts

-

204

$38.110

$27.320

$25.370

-

Avnet

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$22.114

10k+ parts

$19.118

3,000

-

-

$22.114

$19.118

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$20.200

10k+ parts

-

1,000

-

-

$20.200

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,724 parts In-Stock

1+ parts

$19.295

100+ parts

-

1k+ parts

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10k+ parts

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4,724

$19.295

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-

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Vyrian

USA . 5,217 parts In-Stock

1+ parts

$20.200

100+ parts

-

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5,217

$20.200

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Chip Stock

USA . 6,150 parts In-Stock

1+ parts

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6,150

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Anansix

USA . 1,307 parts In-Stock

1+ parts

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1,307

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 742 parts In-Stock

1+ parts

$6.792

100+ parts

-

1k+ parts

$7.442

10k+ parts

-

742

$6.792

-

$7.442

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DigiPath Technology Company

USA . 1,743 parts In-Stock

1+ parts

$7.479

100+ parts

-

1k+ parts

-

10k+ parts

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1,743

$7.479

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ChromeModa Solutions

Germany . 6,464 parts In-Stock

1+ parts

$7.632

100+ parts

$6.258

1k+ parts

-

10k+ parts

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6,464

$7.632

$6.258

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IDEA Electronic Components Group

UK . 22 parts In-Stock

1+ parts

$7.632

100+ parts

-

1k+ parts

$6.869

10k+ parts

-

22

$7.632

-

$6.869

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Corphita

USA . 4,689 parts In-Stock

1+ parts

$18.280

100+ parts

-

1k+ parts

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10k+ parts

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4,689

$18.280

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Component Stockers USA

USA . 14,617 parts In-Stock

1+ parts

$19.520

100+ parts

$24.030

1k+ parts

$18.250

10k+ parts

$18.250

14,617

$19.520

$24.030

$18.250

$18.250

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Kepictronics

USA . 503 parts In-Stock

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503

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Overview

Unleash the power of seamless analog data transmission with the LMH0395SQ/NOPB by Texas Instruments. Crafted with precision and expertise, this cutting-edge device offers unparalleled quality and reliability in its category of Analog Data Transmission Interfaces. From its surface mount capability to its innovative package shape, this product delivers seamless connectivity and high performance. Elevate your projects with the unmatched value, benefits, and advantages that the LMH0395SQ/NOPB provides, making it the ultimate choice for all your data transmission needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape offers a compact design, making it suitable for applications where space is limited.

Power Supplies (V): 2.5

Operates on a standard voltage of 2.5V, ensuring compatibility with common power supplies.

No. of Terminals: 24

With 24 terminals, this interface provides ample connectivity options for versatile data transmission.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal management and overall performance in a compact form factor.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85°C, making it suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this interface can also operate reliably in cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and ensures reliable electrical connections.

Terminal Position: QUAD

Quad terminal position offers a robust connection for stable data transmission in various environments.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8mm, this interface can be easily integrated into slimline devices or applications with height restrictions.

Width: 4 mm

Compact width of 4mm enables space-saving installation on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of withstanding peak reflow temperatures for up to 30 seconds, ensuring reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for efficient soldering processes without damaging the interface.

Length: 4 mm

A length of 4mm provides a compact footprint for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically encountered in industrial settings.

Terminal Form: NO LEAD

No lead terminal form complies with RoHS regulations and provides a more environmentally friendly design.

Maximum Supply Current: 0.078 mA

Low maximum supply current of 0.078mA helps in minimizing power consumption and extending battery life in portable devices.

Telecom IC Type: LINE EQUALIZER

Designed specifically as a line equalizer for telecom applications, ensuring optimal signal integrity and transmission quality.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5V ensures compatibility with standard power sources and stable operation.

Terminal Pitch: 0.5 mm

Terminal pitch of 0.5mm provides a fine-pitch connection for high-density mounting applications.

Data Rate: 2970 Mbps

High data rate of 2970Mbps facilitates fast and efficient data transmission for high-performance applications.

Technical Specifications

Analog Data Transmission Interfaces LMH0395SQ/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

2970 Mbps

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.078 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

LMH0395SQ/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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