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DS30EA101SQX

Texas Instruments

DS30EA101SQX by Texas Instruments

DS30EA101SQX by Texas Instruments is a 16-terminal analog data transmission interface with a square package shape. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of 2.5 V. Ideal for telecom applications as a line equalizer, this chip carrier features no-lead terminal form and very thin profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,562 parts In-Stock

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Digiode

USA . 3,483 parts In-Stock

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3,483

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Bristol Electronics

USA . 1,400 parts In-Stock

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1,400

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Distributors (Availability)

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Native Components

USA . 142 parts In-Stock

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$0.054

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$0.052

142

$0.054

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$0.052

Parana Technologies

USA . 1,296 parts In-Stock

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$12.254

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$12.676

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$12.254

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$12.676

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DigiPath Technology Company

USA . 2,255 parts In-Stock

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$13.493

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$12.413

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$12.413

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ChromeModa Solutions

Germany . 2,413 parts In-Stock

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$13.768

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$11.290

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$13.768

$11.290

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IDEA Electronic Components Group

UK . 1,358 parts In-Stock

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$13.768

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$13.080

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$12.391

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1,358

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AZTECH Wire

Italy . 374 parts In-Stock

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$18.318

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374

$18.318

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One Stop Electronics

USA . 250 parts In-Stock

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$746.000

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250

$746.000

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Corphita

USA . 3,365 parts In-Stock

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Northwest PG Solutions

USA . 2,345 parts In-Stock

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Kepictronics

USA . 546 parts In-Stock

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Overview

Experience seamless analog data transmission with the DS30EA101SQX by Texas Instruments. Trusted for its quality and reliability, Texas Instruments offers cutting-edge solutions in the category of Analog Data Transmission Interfaces. This versatile product boasts a square surface mount package shape with 16 terminals, making it ideal for various applications. With a wide operating temperature range and industrial-grade performance, the DS30EA101SQX provides exceptional value and benefits to customers seeking high-quality line equalizers for their telecom IC needs. Elevate your data transmission experience with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient mounting on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides a uniform and compact design, making it suitable for applications where space is limited.

No. of Terminals: 16

With 16 terminals, this product offers flexibility in connectivity options and can accommodate multiple input and output signals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style ensures efficient heat dissipation and minimal space requirements.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40°C) makes this product suitable for use in harsh and extreme conditions.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection, ensuring a secure and stable electrical connection.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm enables low-profile design and integration in compact electronic devices.

Width: 4 mm

Compact width of 4 mm makes this product suitable for applications where space is limited.

Length: 4 mm

Short length of 4 mm contributes to the overall compact design of the product, allowing for space-efficient installation.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the product can withstand rugged environmental conditions and operate reliably in industrial settings.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and ensures compliance with RoHS regulations for environmentally friendly manufacturing.

Telecom IC Type: LINE EQUALIZER

Line equalizer telecom IC type helps in compensating for signal distortions and attenuation in communication systems, ensuring high-quality data transmission.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5 V ensures consistent and reliable operation of the product.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm allows for high-density mounting and facilitates precise connections, ideal for compact electronic designs.

Technical Specifications

Analog Data Transmission Interfaces DS30EA101SQX attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

DS30EA101SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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