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STLC30R81

STMicroelectronics

STLC30R81 by STMicroelectronics

STLC30R81 by STMicroelectronics is a versatile analog data transmission interface designed for telecom applications. It operates at 3.3V with a max noise of 84 dBrnC and supports -40 °C to 85 °C temp range. Its compact flatpack design ensures efficient performance in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,571 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,571

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Anansix

USA . 1,018 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,018

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Digiode

USA . 52 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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52

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,070 parts In-Stock

1+ parts

$7.658

100+ parts

-

1k+ parts

$6.892

10k+ parts

-

1,070

$7.658

-

$6.892

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MKK Technologies

India . 927 parts In-Stock

1+ parts

$14.401

100+ parts

-

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10k+ parts

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927

$14.401

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DigiPath Technology Company

USA . 927 parts In-Stock

1+ parts

$14.401

100+ parts

-

1k+ parts

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10k+ parts

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927

$14.401

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Corphita

USA . 4,661 parts In-Stock

1+ parts

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4,661

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Parana Technologies

USA . 2,323 parts In-Stock

1+ parts

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100+ parts

$9.156

1k+ parts

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10k+ parts

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2,323

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$9.156

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Overview

Elevate your connectivity with the STLC30R81 by STMicroelectronics, a pinnacle of reliability in analog data transmission interfaces. Crafted from high-quality materials, this robust component excels in both temperature resilience and noise performance, making it ideal for demanding industrial applications. Choose STMicroelectronics for unparalleled quality and trustworthiness, ensuring seamless integration and efficiency that drive your projects forward. Unlock unmatched value and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures long-lasting performance and resilience against environmental factors.

Surface Mount: YES

Facilitates compact designs and efficient use of PCB space, making assembly easier.

Package Shape: SQUARE

Square shape allows for efficient thermal management and better fitting in varied applications.

Power Supplies (V): 3.3

Standard voltage level supports a wide range of applications, enhancing compatibility.

No. of Terminals: 44

Provides ample connections for complex circuit designs, allowing for versatile applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Low profile design aids in space-constrained applications while enabling effective heat dissipation.

Maximum Noise: 84 dBrnC

Low noise performance enhances signal integrity, making it suitable for high-quality analog transmission.

Maximum Operating Temperature: 85 °C

High tolerance to temperature extremes increases reliability in industrial environments.

Battery Supply (V): -38 AND -74

Flexible battery supply range supports various operational needs, ensuring versatility.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable performance in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish reduces corrosion and enhances conductivity for better performance.

Terminal Position: QUAD

Quad arrangement simplifies routing on the PCB, improving overall design efficiency.

Maximum Seated Height: 1.6 mm

Low height supports compact designs, particularly in space-restricted applications.

Width: 10 mm

Standard width allows for easy integration into existing designs and systems.

Minimum Power Supply Rejection Ratio (PSRR): 27 dB

Good PSRR ensures stable operation even with varying power supply conditions, enhancing reliability.

Battery Feed: CONSTANT CURRENT/RESISTIVE

Supports consistent performance with varying loads, making it ideal for dynamic applications.

Length: 10 mm

Compact length contributes to overall product efficiency in limited real estate design.

Temperature Grade: INDUSTRIAL

Industrial grade assures robust performance in demanding environments, ensuring longevity and reliability.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint strength, enabling reliable connections.

Telecom IC Type: SLIC

Specialized IC type designed for telecom applications, ensuring high performance in signal processing.

Nominal Supply Voltage: 3.3 V

Nominal voltage simplifies design considerations and reduces complexity in circuit integration.

Hybrid 2-4 CONVERSION

Supports versatile communication protocols, enhancing product capability in various applications.

Terminal Pitch: 0.8 mm

Compact terminal pitch allows for high-density designs, maximizing available PCB space.

Technical Specifications

Analog Data Transmission Interfaces STLC30R81 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from STMicroelectronics

Specs

Battery Feed:

CONSTANT CURRENT/RESISTIVE

Battery Supply (V):

-38 AND -74

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

Maximum Noise:

84 dBrnC

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

27 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Analog Transmission Interfaces

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STLC30R81 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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