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LMH0044SQE

Texas Instruments

LMH0044SQE by Texas Instruments

LMH0044SQE by Texas Instruments is a 16-terminal analog data transmission interface with a 3.3V supply voltage. It features a max operating temperature of 85°C and is designed for telecom applications as a line equalizer IC in surface-mount square package style.

Median Price

$16.182

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$16.182

100+ parts

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50

$16.182

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Vyrian

USA . 6,515 parts In-Stock

1+ parts

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6,515

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Digiode

USA . 2,488 parts In-Stock

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2,488

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Anansix

USA . 2,027 parts In-Stock

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2,027

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 5,544 parts In-Stock

1+ parts

$6.870

100+ parts

$6.520

1k+ parts

$6.320

10k+ parts

-

5,544

$6.870

$6.520

$6.320

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AZTECH Wire

Italy . 446 parts In-Stock

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$9.143

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446

$9.143

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Parana Technologies

USA . 2,133 parts In-Stock

1+ parts

$13.852

100+ parts

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$14.334

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2,133

$13.852

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$14.334

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IDEA Electronic Components Group

UK . 1,033 parts In-Stock

1+ parts

$15.564

100+ parts

$14.786

1k+ parts

$14.008

10k+ parts

-

1,033

$15.564

$14.786

$14.008

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ChromeModa Solutions

Germany . 761 parts In-Stock

1+ parts

$15.564

100+ parts

$12.762

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761

$15.564

$12.762

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One Stop Electronics

USA . 1,237 parts In-Stock

1+ parts

$22.000

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1,237

$22.000

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Lixinc

USA . 3,910 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,313 parts In-Stock

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Corphita

USA . 1,412 parts In-Stock

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1,412

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DigiPath Technology Company

USA . 568 parts In-Stock

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$14.033

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568

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$14.033

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Microchip USA

USA . 353 parts In-Stock

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353

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Overview

Enhance your analog data transmission interfaces with the LMH0044SQE by Texas Instruments! This top-quality product offers exceptional value and benefits, thanks to its reliable manufacturer and innovative design. Ideal for a wide range of applications, this square-shaped chip carrier boasts a very thin profile and a low supply current of 0.077 mA. Experience seamless communication and superior performance with the LMH0044SQE - your go-to solution for all your transmission needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto a printed circuit board, reducing production time and costs.

Package Shape: SQUARE

Square package shape provides a compact design that saves space on the PCB, making it suitable for applications with limited board real estate.

Power Supplies (V): 3.3

Operating at 3.3V allows for compatibility with a wide range of systems and power sources, making the product versatile and easy to integrate.

No. of Terminals: 16

With 16 terminals, this product provides multiple connection points for enhanced functionality and signal transmission capability.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and overall compactness for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding environmental conditions or extended usage.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows for operation in a wide range of temperature environments, making the product versatile and suitable for different applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring secure connections for reliable data transmission.

Terminal Position: QUAD

Quad terminal position allows for better organization and routing of connections, simplifying the assembly process and enhancing signal integrity.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8mm contributes to a slim and streamlined design that is suitable for compact and space-saving applications.

Width: 4 mm

The narrow width of 4mm enables easy integration into tight spaces on the PCB, making the product versatile and suitable for various form factors.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high-temperature soldering processes, ensuring reliable and durable connections during assembly.

Length: 4 mm

The short length of 4mm contributes to a compact and space-efficient design that is ideal for applications with limited board space.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and ensures environmental friendliness, making the product a sustainable choice.

Maximum Supply Current: 0.077 mA

The low maximum supply current of 0.077mA indicates efficient power consumption, making the product energy-efficient and suitable for battery-powered applications.

Telecom IC Type: LINE EQUALIZER

Line equalizer telecom IC type enhances signal quality and integrity by compensating for signal attenuation and distortion, making the product ideal for data transmission applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and systems, making the product easy to integrate and use.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for dense packing of terminals on the PCB, increasing connectivity options and signal routing flexibility.

Technical Specifications

Analog Data Transmission Interfaces LMH0044SQE attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.077 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LMH0044SQE Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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