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LMH0395SQX/NOPB

Texas Instruments

LMH0395SQX/NOPB by Texas Instruments

LMH0395SQX/NOPB by Texas Instruments is a 24-terminal analog data transmission interface with a 2.5V supply voltage and 2970 Mbps data rate. It features a square package shape, operates in industrial temperature range (-40 to 85 °C), and is ideal for telecom applications as a line equalizer IC.

Median Price

$22.687

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,974 parts In-Stock

1+ parts

$22.687

100+ parts

$20.166

1k+ parts

$14.828

10k+ parts

-

12,974

$22.687

$20.166

$14.828

-

Rochester

USA . 31,150 parts In-Stock

1+ parts

-

100+ parts

$21.320

1k+ parts

$19.070

10k+ parts

$17.950

31,150

-

$21.320

$19.070

$17.950

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$26.650

1k+ parts

$23.837

10k+ parts

$22.438

9,000

-

$26.650

$23.837

$22.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,992 parts In-Stock

1+ parts

$19.560

100+ parts

-

1k+ parts

-

10k+ parts

-

4,992

$19.560

-

-

-

Vyrian

USA . 3,835 parts In-Stock

1+ parts

$20.590

100+ parts

-

1k+ parts

-

10k+ parts

-

3,835

$20.590

-

-

-

Chip Stock

USA . 4,066 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,066

-

-

-

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Anansix

USA . 2,493 parts In-Stock

1+ parts

-

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2,493

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 77 parts In-Stock

1+ parts

$13.873

100+ parts

-

1k+ parts

$14.352

10k+ parts

-

77

$13.873

-

$14.352

-

ChromeModa Solutions

Germany . 4,963 parts In-Stock

1+ parts

$15.588

100+ parts

$12.782

1k+ parts

-

10k+ parts

-

4,963

$15.588

$12.782

-

-

IDEA Electronic Components Group

UK . 2,091 parts In-Stock

1+ parts

$15.588

100+ parts

$14.809

1k+ parts

$14.029

10k+ parts

-

2,091

$15.588

$14.809

$14.029

-

Corphita

USA . 3,621 parts In-Stock

1+ parts

$18.531

100+ parts

-

1k+ parts

-

10k+ parts

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3,621

$18.531

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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13,785

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-

-

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Lixinc

USA . 11,854 parts In-Stock

1+ parts

-

100+ parts

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11,854

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-

-

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,000

-

-

-

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A-Z Elektronik GmbH

Germany . 5,339 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,339

-

-

-

-

Alle Elektronik GmbH

Germany . 3,559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,559

-

-

-

-

Perfect Parts

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,680

-

-

-

-

DigiPath Technology Company

USA . 1,151 parts In-Stock

1+ parts

-

100+ parts

$14.054

1k+ parts

-

10k+ parts

-

1,151

-

$14.054

-

-

Kepictronics

USA . 503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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503

-

-

-

-

Overview

Enhance your analog data transmission interfaces with the LMH0395SQX/NOPB by Texas Instruments. Designed with precision and reliability in mind, this square package chip carrier provides top-notch performance for a wide range of industrial applications. With its matte tin terminal finish and very thin profile, this line equalizer ensures seamless data transmission at a lightning-fast speed of 2970 Mbps. Trust Texas Instruments to deliver exceptional quality and value with the LMH0395SQX/NOPB, the ultimate solution for all your telecom IC needs.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on circuit boards for efficient assembly and integration into systems.

Power Supplies (V): 2.5

Operates on a low supply voltage, suitable for a wide range of applications and helps in reducing power consumption.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package style with efficient heat dissipation and low profile design for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures, suitable for industrial environments and applications where heat dissipation is a concern.

Maximum Seated Height: 0.8 mm

Low profile design for compact and slim devices, enabling flexibility in product design and layout.

Data Rate: 2970 Mbps

High data rate capability for fast and efficient transmission of analog data, ideal for high-speed communication applications.

Technical Specifications

Analog Data Transmission Interfaces LMH0395SQX/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

2970 Mbps

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.078 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

LMH0395SQX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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