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LMH0395SQE/NOPB

Texas Instruments

LMH0395SQE/NOPB by Texas Instruments

LMH0395SQE/NOPB by Texas Instruments is a 24-terminal analog data transmission interface with a 2.5V supply voltage and 2970 Mbps data rate. It features a max operating temperature of 85°C, making it suitable for industrial telecom applications requiring line equalization at high speeds. The chip carrier package style with a square shape and very thin profile enables surface mount installation in compact spaces.

Median Price

$27.754

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,583 parts In-Stock

1+ parts

$25.747

100+ parts

$22.886

1k+ parts

$16.828

10k+ parts

-

13,583

$25.747

$22.886

$16.828

-

DigiKey

USA . 283 parts In-Stock

1+ parts

$38.110

100+ parts

$29.262

1k+ parts

$26.393

10k+ parts

-

283

$38.110

$29.262

$26.393

-

Mouser Electronics

USA . 25 parts In-Stock

1+ parts

$38.110

100+ parts

$29.250

1k+ parts

$26.390

10k+ parts

-

25

$38.110

$29.250

$26.390

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Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

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$22.120

10k+ parts

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250

-

-

$22.120

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Rochester

USA . 104 parts In-Stock

1+ parts

-

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$23.810

1k+ parts

$21.300

10k+ parts

$20.050

104

-

$23.810

$21.300

$20.050

Verical

USA . 104 parts In-Stock

1+ parts

-

100+ parts

$29.762

1k+ parts

$26.625

10k+ parts

$25.063

104

-

$29.762

$26.625

$25.063

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,191 parts In-Stock

1+ parts

$22.202

100+ parts

-

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-

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3,191

$22.202

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$22.996

100+ parts

-

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100

$22.996

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Chip Stock

USA . 6,260 parts In-Stock

1+ parts

-

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6,260

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Vyrian

USA . 2,686 parts In-Stock

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2,686

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Anansix

USA . 1,659 parts In-Stock

1+ parts

-

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1,659

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ACDS - Activité Composants Distribution Service

France . 266 parts In-Stock

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266

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TME

Poland . 250 parts In-Stock

1+ parts

-

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$31.850

10k+ parts

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250

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$31.850

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Sensible Micro Corp

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 363 parts In-Stock

1+ parts

$11.847

100+ parts

-

1k+ parts

$12.246

10k+ parts

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363

$11.847

-

$12.246

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DigiPath Technology Company

USA . 843 parts In-Stock

1+ parts

$13.045

100+ parts

$12.001

1k+ parts

-

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843

$13.045

$12.001

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ChromeModa Solutions

Germany . 3,859 parts In-Stock

1+ parts

$13.311

100+ parts

$10.915

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-

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3,859

$13.311

$10.915

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IDEA Electronic Components Group

UK . 82 parts In-Stock

1+ parts

$13.311

100+ parts

$12.645

1k+ parts

$11.980

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82

$13.311

$12.645

$11.980

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Ampacity Inc.

Singapore . 2,404 parts In-Stock

1+ parts

$17.290

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2,404

$17.290

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Corphita

USA . 920 parts In-Stock

1+ parts

$21.033

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920

$21.033

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Netroflash

USA . 500 parts In-Stock

1+ parts

$22.996

100+ parts

-

1k+ parts

$21.846

10k+ parts

$21.387

500

$22.996

-

$21.846

$21.387

A-Z Elektronik GmbH

Germany . 5,699 parts In-Stock

1+ parts

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5,699

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Alle Elektronik GmbH

Germany . 3,799 parts In-Stock

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3,799

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Kepictronics

USA . 503 parts In-Stock

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503

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Authorized Procurement Solutions

USA . 322 parts In-Stock

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Lixinc

USA . 214 parts In-Stock

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214

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Perfect Parts

USA . 72 parts In-Stock

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72

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Overview

Enhance your analog data transmission systems with the LMH0395SQE/NOPB from Texas Instruments. This high-quality line equalizer offers top-notch performance and reliability, thanks to its innovative design and advanced technology. Whether you're in the telecommunications industry or working on industrial applications, this versatile chip carrier promises seamless integration and superior signal quality. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations. Elevate your projects with the LMH0395SQE/NOPB today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards, saving time and effort in assembly.

Package Shape: SQUARE

Square package shape provides a compact design that helps in saving space and optimizing layout in electronic devices.

Power Supplies (V): 2.5

Operates at a standard voltage of 2.5V, making it compatible with a wide range of applications and power sources.

No. of Terminals: 24

Provides multiple terminals for connecting various components and interfaces, enhancing versatility and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers different package styles for flexibility in design and efficient heat dissipation, ensuring optimal performance in various conditions.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures up to 85°C, suitable for industrial environments and extended usage.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperatures down to -40°C, making it suitable for outdoor and harsh conditions.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides corrosion resistance and improved solderability for reliable connections over time.

Terminal Position: QUAD

Quad terminal position offers stable and secure connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for a slim profile and space-saving design that is ideal for compact electronic devices.

Width: 4 mm

Narrow width of 4mm enables efficient placement and integration of the component within limited spaces, optimizing the overall layout.

Maximum Time At Peak Reflow Temperature (s): 30

Short time duration at peak reflow temperature of 260°C ensures proper soldering and component reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability of 260°C ensures secure solder joints and lasting connections for long-term performance.

Length: 4 mm

Compact length of 4mm contributes to a space-efficient design and easy integration into electronic circuits and systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable operation in demanding environments, making it suitable for various industrial applications.

Terminal Form: NO LEAD

No-lead terminal form eliminates the use of environmentally harmful materials, promoting sustainability and eco-friendly manufacturing.

Maximum Supply Current: 0.078 mA

Low maximum supply current of 0.078 mA helps in reducing power consumption and minimizing energy usage for cost-effective operation.

Telecom IC Type: LINE EQUALIZER

Specialized telecom IC type for line equalization ensures optimal signal transmission and reception quality, improving overall communication performance.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5V ensures stable and reliable operation in various voltage conditions, maintaining consistent performance.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5mm facilitates precise and secure connections, reducing the risk of signal distortion or loss.

Data Rate: 2970 Mbps

High data rate of 2970 Mbps enables fast and efficient data transmission, ideal for high-speed communication applications and data-intensive tasks.

Technical Specifications

Analog Data Transmission Interfaces LMH0395SQE/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

2970 Mbps

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.078 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

LMH0395SQE/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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