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LMH0344GRE/NOPB

Texas Instruments

LMH0344GRE/NOPB by Texas Instruments

LMH0344GRE/NOPB by Texas Instruments is a 25-terminal analog data transmission interface with a package style of grid array, thin profile, and fine pitch. Operating at temperatures from -40 to 85°C, it has a data rate of 2970 Mbps and is ideal for telecom applications as a line equalizer IC.

Median Price

$14.110

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,565 parts In-Stock

1+ parts

$14.110

100+ parts

$12.325

1k+ parts

$8.500

10k+ parts

-

4,565

$14.110

$12.325

$8.500

-

Rochester

USA . 6,213 parts In-Stock

1+ parts

-

100+ parts

$12.220

1k+ parts

$10.930

10k+ parts

$10.290

6,213

-

$12.220

$10.930

$10.290

Verical

USA . 5,713 parts In-Stock

1+ parts

-

100+ parts

$15.275

1k+ parts

$13.662

10k+ parts

$12.863

5,713

-

$15.275

$13.662

$12.863

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,081 parts In-Stock

1+ parts

$11.220

100+ parts

-

1k+ parts

-

10k+ parts

-

4,081

$11.220

-

-

-

Vyrian

USA . 1,084 parts In-Stock

1+ parts

$11.810

100+ parts

-

1k+ parts

-

10k+ parts

-

1,084

$11.810

-

-

-

Anansix

USA . 433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

433

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,679 parts In-Stock

1+ parts

$10.393

100+ parts

$965.187

1k+ parts

$9.354

10k+ parts

-

1,679

$10.393

$965.187

$9.354

-

Corphita

USA . 2,240 parts In-Stock

1+ parts

$10.629

100+ parts

-

1k+ parts

-

10k+ parts

-

2,240

$10.629

-

-

-

DigiPath Technology Company

USA . 2,250 parts In-Stock

1+ parts

$11.444

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

$11.444

-

-

-

ChromeModa Solutions

Germany . 6,691 parts In-Stock

1+ parts

$11.678

100+ parts

$9.576

1k+ parts

-

10k+ parts

-

6,691

$11.678

$9.576

-

-

IDEA Electronic Components Group

UK . 345 parts In-Stock

1+ parts

$11.678

100+ parts

$11.094

1k+ parts

$10.510

10k+ parts

-

345

$11.678

$11.094

$10.510

-

Component Stockers USA

USA . 14,625 parts In-Stock

1+ parts

$12.080

100+ parts

$11.350

1k+ parts

$9.110

10k+ parts

-

14,625

$12.080

$11.350

$9.110

-

Lixinc

USA . 9,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,701

-

-

-

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A-Z Elektronik GmbH

Germany . 5,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,855

-

-

-

-

Alle Elektronik GmbH

Germany . 3,903 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,903

-

-

-

-

Perfect Parts

USA . 683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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683

-

-

-

-

Overview

Elevate your analog data transmission with the LMH0344GRE/NOPB by Texas Instruments. Crafted with precision and expertise, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this line equalizer boasts a sleek design with grid array packaging and thin profile. With a nominal supply voltage of 3.3V and maximum data rate of 2970 Mbps, this industrial-grade marvel ensures seamless connectivity and optimal performance. Experience the value and benefits that this innovative solution brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ideal for applications where portability and reliability are key.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort in the assembly process.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of systems and devices, making the product versatile and easy to integrate.

No. of Terminals: 25

With 25 terminals available, this product offers ample connectivity options, allowing for versatile and customizable configurations to meet specific application needs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions, making the product suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can withstand extreme cold conditions, expanding its usability in various environments.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission and longevity of the product.

Maximum Seated Height: 1.1 mm

The thin profile with a maximum seated height of 1.1mm allows for compact design and integration in space-constrained applications, optimizing board space utilization.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is commonly used in many electronic systems, ensuring seamless integration and compatibility with various devices.

Data Rate: 2970 Mbps

The high data rate of 2970 Mbps enables fast and efficient data transmission, making the product suitable for high-speed communication applications.

Technical Specifications

Analog Data Transmission Interfaces LMH0344GRE/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

2970 Mbps

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.1 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

LMH0344GRE/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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