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STLC3080

STMicroelectronics

STLC3080 by STMicroelectronics

STLC3080 by STMicroelectronics is a low-profile, square telecom IC designed for analog data transmission. It operates at 3.3V to 5V with a max temp of 85 °C and features a PSRR of 27 dB. Ideal for industrial applications, it supports constant current battery feeds.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,498 parts In-Stock

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7,498

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Anansix

USA . 2,194 parts In-Stock

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2,194

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LWI Electronics Inc

India . 642 parts In-Stock

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642

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Digiode

USA . 224 parts In-Stock

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224

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 9 parts In-Stock

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PC Components Company LLC

USA . 8 parts In-Stock

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Bristol Electronics

USA . 8 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 290 parts In-Stock

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$10.816

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290

$10.816

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IDEA Electronic Components Group

UK . 425 parts In-Stock

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$13.818

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$12.437

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425

$13.818

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$12.437

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AZTECH Wire

Italy . 462 parts In-Stock

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$16.710

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462

$16.710

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MKK Technologies

India . 965 parts In-Stock

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$25.985

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965

$25.985

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DigiPath Technology Company

USA . 965 parts In-Stock

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$25.985

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965

$25.985

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Vigor

Singapore . 8,039 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,102 parts In-Stock

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Kepictronics

USA . 3,760 parts In-Stock

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Parana Technologies

USA . 1,466 parts In-Stock

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$16.522

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Corphita

USA . 1,188 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Overview

Elevate your designs with the STLC3080 from STMicroelectronics, a leader renowned for innovation and quality. This versatile analog data transmission interface excels in diverse applications, ensuring robust performance even in extreme conditions. Benefit from its low profile design and exceptional reliability, perfect for telecom solutions. Choose STMicroelectronics and empower your projects with unmatched durability and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and protection against environmental factors, making the product suitable for industrial applications.

Surface Mount: YES

Surface mount technology enables compact design and efficient use of board space, making assembly easier and more cost-effective.

Package Shape: SQUARE

The square package shape facilitates symmetric design, allowing for efficient signal routing and placement on PCBs.

Power Supplies (V): 3.3, 5

Supports multiple power supply voltages, offering flexibility for integration into various systems.

No. of Terminals: 44

With 44 terminals, this IC provides ample connectivity options for complex applications, enhancing its versatility.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is ideal for applications with space constraints, ensuring easy integration into slim devices.

Maximum Operating Temperature: 85 °C

A maximum temperature rating of 85 °C ensures reliable operation in harsh environments, suitable for industrial usage.

Battery Supply (V): -48

A negative battery supply option offers versatility for telecom applications and allows for better integration with specific systems.

Minimum Operating Temperature: -40 °C

The ability to function in extreme low temperatures (-40 °C) enhances reliability, making the product ideal for challenging conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish improves conductivity and enhances solderability, ensuring strong connections and durability.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout options on PCBs, reducing signal path lengths and enhancing performance.

Maximum Seated Height: 1.6 mm

A low seated height ensures compatibility with various design requirements, particularly for compact devices.

Width: 10 mm

A width of 10 mm is suitable for a wide range of PCB layouts, providing flexibility for designers.

Minimum Power Supply Rejection Ratio (PSRR): 27 dB

A PSRR of 27 dB indicates good performance in rejecting power supply noise, crucial for maintaining signal integrity.

Battery Feed: CONSTANT CURRENT/RESISTIVE

The constant current/resistive battery feed option allows for precise power management, enhancing device reliability.

Length: 10 mm

A compact length of 10 mm is ideal for saving space in electronic designs, making it a practical choice for many applications.

Temperature Grade: INDUSTRIAL

Being graded for industrial use means this product is built to withstand the rigors of industrial environments, ensuring longevity.

Terminal Form: GULL WING

Gull wing terminal forms provide excellent mechanical stability and solderability, ensuring robust connections on PCBs.

Maximum Supply Current: 0.0055 mA

A low maximum supply current ensures energy efficiency, making this product suitable for battery-powered applications.

Telecom IC Type: SLIC

Being a SLIC (Subscriber Line Interface Circuit) type makes this product ideal for telecommunications applications, ensuring effective signal processing.

Nominal Supply Voltage: 5 V

Operates at a nominal supply voltage of 5 V, compatible with most systems and reducing the need for complex power supplies.

Hybrid 2-4 CONVERSION

Offers hybrid 2-4 conversion capabilities, enhancing versatility and functionality for various audio and telephony applications.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is commonly used in the industry, ensuring compatibility with standard PCB layouts and components.

Technical Specifications

Analog Data Transmission Interfaces STLC3080 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from STMicroelectronics

Specs

Battery Feed:

CONSTANT CURRENT/RESISTIVE

Battery Supply (V):

-48

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

27 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

.0055 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STLC3080 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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