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LMH0384SQ

Texas Instruments

LMH0384SQ by Texas Instruments

LMH0384SQ by Texas Instruments is a 16-terminal analog data transmission interface with a square package shape. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3.3V. This telecom IC type line equalizer is designed for surface mount applications with a compact size of 4x4mm, making it suitable for various communication systems.

Median Price

$18.870

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 909 parts In-Stock

1+ parts

$18.870

100+ parts

$18.490

1k+ parts

$18.120

10k+ parts

-

909

$18.870

$18.490

$18.120

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,769 parts In-Stock

1+ parts

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3,769

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Digiode

USA . 3,136 parts In-Stock

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3,136

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Anansix

USA . 1,423 parts In-Stock

1+ parts

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1,423

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LWI Electronics Inc

India . 4 parts In-Stock

1+ parts

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4

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NexGen Digital

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,443 parts In-Stock

1+ parts

$12.378

100+ parts

-

1k+ parts

$12.817

10k+ parts

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1,443

$12.378

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$12.817

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DigiPath Technology Company

USA . 1,406 parts In-Stock

1+ parts

$13.630

100+ parts

$12.539

1k+ parts

-

10k+ parts

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1,406

$13.630

$12.539

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ChromeModa Solutions

Germany . 6,176 parts In-Stock

1+ parts

$13.908

100+ parts

$11.405

1k+ parts

-

10k+ parts

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6,176

$13.908

$11.405

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IDEA Electronic Components Group

UK . 1,959 parts In-Stock

1+ parts

$13.908

100+ parts

$13.213

1k+ parts

$12.517

10k+ parts

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1,959

$13.908

$13.213

$12.517

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AZTECH Wire

Italy . 451 parts In-Stock

1+ parts

$16.372

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451

$16.372

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$20.540

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2,500

$20.540

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One Stop Electronics

USA . 213 parts In-Stock

1+ parts

$610.000

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213

$610.000

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Corphita

USA . 4,167 parts In-Stock

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4,167

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QUARKTWIN TECHNOLOGY LTD

USA . 2,527 parts In-Stock

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2,527

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Overview

Elevate your data transmission experience with the LMH0384SQ by Texas Instruments. Crafted with precision and expertise, this analog data transmission interface offers unparalleled quality and reliability. Whether it's in telecommunications or industrial applications, this product is designed to deliver exceptional performance and efficiency. With its surface mount capability and compact square package shape, the LMH0384SQ provides unmatched value and versatility. Trust Texas Instruments to provide you with innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving time and space in the manufacturing process.

Package Shape: SQUARE

The square package shape offers a compact design, making it suitable for applications where space is limited.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options and flexibility in wiring configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging styles ensures efficient heat dissipation and a small form factor for the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The product's low minimum operating temperature of -40°C ensures reliable performance in cold environments.

Terminal Position: QUAD

The quad terminal position allows for secure connections and stable signal transmission in the product.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm enables a low-profile design that is beneficial for space-constrained applications.

Width: 4 mm

The product's width of 4 mm provides a compact footprint that is suitable for tight layouts or designs.

Length: 4 mm

The product's length of 4 mm contributes to its overall compact size and space-saving capabilities.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in harsh industrial environments with varying temperature conditions.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of soldering defects and improves the overall reliability of the product.

Telecom IC Type: LINE EQUALIZER

With a telecom IC type of line equalizer, this product is designed to optimize signal quality and transmission performance in telecom applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with standard voltage requirements in many electronic systems.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm facilitates easy wiring and connections, making installation and integration hassle-free.

Technical Specifications

Analog Data Transmission Interfaces LMH0384SQ attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LMH0384SQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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