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SI32391-B-FMR

Silicon Labs

SI32391-B-FMR by Silicon Labs

Analog Transmission Interfaces; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 40;

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Digiode

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Microchip USA

USA . 3,874 parts In-Stock

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AZTECH Wire

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Ampacity Inc.

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Argo Parts USA

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Technical Specifications

Analog Data Transmission Interfaces SI32391-B-FMR attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Silicon Labs

Specs

Moisture Sensitivity Level (MSL):

2

Peak Reflow Temperature (C):

260

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

SI32391-B-FMR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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