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LE88286DLC

Microchip Technology

LE88286DLC by Microchip Technology

LE88286DLC by Microchip Technology is an Analog Data Transmission Interface with 80 terminals in a square package. It operates b/w -40 to 85 °C, offering low profile design and high PSRR of 40 dB. Ideal for SLIC telecom ICs, it features CMOS technology and hybrid 2-4 conversion for efficient data transmission.

Median Price

$15.482

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 450 parts In-Stock

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$12.450

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450

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$12.450

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Arrow

USA . 450 parts In-Stock

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$18.515

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$18.343

450

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$18.515

$18.343

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$15.560

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10

$15.560

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Chip Stock

USA . 27,730 parts In-Stock

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Vyrian

USA . 3,319 parts In-Stock

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Electronics Depot

USA . 516 parts In-Stock

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516

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Distributors (Availability)

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Corohmni

South Africa . 711 parts In-Stock

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$11.681

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711

$11.681

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AZTECH Wire

Italy . 612 parts In-Stock

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$13.855

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$13.855

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Continental Prestige Electronics

USA . 334 parts In-Stock

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$15.560

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$15.249

334

$15.560

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$15.249

LOOK Integrated Logistics

Peru . 6,285 parts In-Stock

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LMD Electronica

Estonia . 6,212 parts In-Stock

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Montano Global Distributors

Canada . 5,493 parts In-Stock

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Argo Parts USA

USA . 1,452 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,183 parts In-Stock

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Perfect Parts

USA . 1,008 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$15.249

1k+ parts

$14.782

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$14.471

1,000

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$15.249

$14.782

$14.471

Glotronic Ltd.

UK . 568 parts In-Stock

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568

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NIA Electronics

USA . 499 parts In-Stock

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499

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Ledger Components

France . 499 parts In-Stock

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499

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Component Stockers USA

USA . 385 parts In-Stock

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385

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Authorized Procurement Solutions

USA . 350 parts In-Stock

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350

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GreenTree Electronics

Israel . 350 parts In-Stock

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350

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Microchip USA

USA . 287 parts In-Stock

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Overview

Experience the next level of analog data transmission with the LE88286DLC by Microchip Technology. Known for its high-quality manufacturing standards, this product offers unmatched reliability and performance. Ideal for various applications in the telecom industry, this SLIC hybrid boasts a low profile package design, making it perfect for space-constrained environments. With a nominal supply voltage of 3.3V and impressive minimum power supply rejection ratio of 40dB, customers can trust in the value and benefits that this advanced technology brings to their projects. Elevate your communication systems with the LE88286DLC and discover the difference that Microchip Technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V makes the product compatible with common power sources, ensuring easy integration into existing systems.

Technical Specifications

Analog Data Transmission Interfaces LE88286DLC attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Microchip Technology

Specs

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

Maximum Noise:

19 dBrnC

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

40 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LE88286DLC Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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