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TCM4204AJW-00

Texas Instruments

TCM4204AJW-00 by Texas Instruments

TCM4204AJW-00 by Texas Instruments is an Analog Data Transmission Interface with 24 terminals, CMOS technology, and -5V negative supply voltage. It is used in SLIC telecom ICs for commercial applications, operating b/w 0°C to 70°C with a compact rectangular package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,993 parts In-Stock

1+ parts

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6,993

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Digiode

USA . 2,323 parts In-Stock

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2,323

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,106 parts In-Stock

1+ parts

$9.448

100+ parts

-

1k+ parts

$10.060

10k+ parts

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2,106

$9.448

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$10.060

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DigiPath Technology Company

USA . 1,643 parts In-Stock

1+ parts

$10.404

100+ parts

$9.571

1k+ parts

-

10k+ parts

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1,643

$10.404

$9.571

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ChromeModa Solutions

Germany . 5,312 parts In-Stock

1+ parts

$10.616

100+ parts

$8.705

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-

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5,312

$10.616

$8.705

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IDEA Electronic Components Group

UK . 734 parts In-Stock

1+ parts

$10.616

100+ parts

$10.085

1k+ parts

$9.554

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734

$10.616

$10.085

$9.554

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AZTECH Wire

Italy . 232 parts In-Stock

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$15.823

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232

$15.823

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One Stop Electronics

USA . 1,229 parts In-Stock

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$304.000

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1,229

$304.000

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Corphita

USA . 1,621 parts In-Stock

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1,621

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Overview

Enhance your analog data transmission with the TCM4204AJW-00 by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. Designed for a wide range of applications, this product offers unmatched value and benefits to customers seeking reliable and efficient solutions. With its innovative technology and superior performance, this SLIC telecom IC ensures seamless communication and optimal functionality. Trust in Texas Instruments for cutting-edge products that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection, ensuring the product can withstand various environmental conditions.

No. of Terminals: 24

Having 24 terminals allows for versatility and compatibility with a wide range of systems and devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in challenging and demanding environments.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Nominal Supply Voltage: 5 V

The 5V supply voltage ensures compatibility with common power sources, making the product easy to integrate into existing systems.

Technical Specifications

Analog Data Transmission Interfaces TCM4204AJW-00 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-GDIP-T24

Length:

32.05 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TCM4204AJW-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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