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TCM4207AJ-00

Texas Instruments

TCM4207AJ-00 by Texas Instruments

TCM4207AJ-00 by Texas Instruments is an Analog Data Transmission Interface with 24 terminals in a RECTANGULAR package. It operates b/w 0°C to 70°C, with -5V negative supply voltage and 5V nominal voltage. Ideal for SLIC telecom applications due to its IN-LINE package style and THROUGH-HOLE terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,339 parts In-Stock

1+ parts

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7,339

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Digiode

USA . 522 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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522

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,605 parts In-Stock

1+ parts

$6.422

100+ parts

-

1k+ parts

$7.169

10k+ parts

-

1,605

$6.422

-

$7.169

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ChromeModa Solutions

Germany . 4,562 parts In-Stock

1+ parts

$7.216

100+ parts

$5.917

1k+ parts

-

10k+ parts

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4,562

$7.216

$5.917

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IDEA Electronic Components Group

UK . 1,614 parts In-Stock

1+ parts

$7.216

100+ parts

-

1k+ parts

$6.494

10k+ parts

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1,614

$7.216

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$6.494

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AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$11.393

100+ parts

-

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223

$11.393

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One Stop Electronics

USA . 1,293 parts In-Stock

1+ parts

$946.000

100+ parts

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1,293

$946.000

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Corphita

USA . 528 parts In-Stock

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528

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DigiPath Technology Company

USA . 127 parts In-Stock

1+ parts

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100+ parts

$6.506

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127

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$6.506

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Overview

Upgrade your analog data transmission interfaces with the TCM4207AJ-00 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you a high-performance solution that is perfect for various applications in the telecommunications industry. With its ceramic, glass-sealed package and commercial temperature grade, this product offers unmatched value, benefits, and advantages to customers. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs effortlessly.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for internal components, making the product suitable for various environmental conditions.

No. of Terminals: 24

With 24 terminals, this product allows for versatile connections and interfaces, enabling it to be used in a wide range of applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in elevated temperature environments.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many applications, making this product compatible with a wide range of systems and devices.

Technical Specifications

Analog Data Transmission Interfaces TCM4207AJ-00 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-GDIP-T24

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

TCM4207AJ-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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