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TCM4205AJ-00

Texas Instruments

TCM4205AJ-00 by Texas Instruments

TCM4205AJ-00 by Texas Instruments is an Analog Data Transmission Interface with 28 terminals, operating at -5V to 5V. It features a ceramic package, rectangular shape, and through-hole terminal form. Ideal for SLIC telecom applications with a max supply current of 13mA and commercial temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,914 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,914

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-

-

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Digiode

USA . 3,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,280

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 800 parts In-Stock

1+ parts

$5.600

100+ parts

-

1k+ parts

-

10k+ parts

-

800

$5.600

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-

-

Parana Technologies

USA . 2,218 parts In-Stock

1+ parts

$7.719

100+ parts

-

1k+ parts

$8.252

10k+ parts

-

2,218

$7.719

-

$8.252

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DigiPath Technology Company

USA . 434 parts In-Stock

1+ parts

$8.500

100+ parts

$7.820

1k+ parts

-

10k+ parts

-

434

$8.500

$7.820

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-

ChromeModa Solutions

Germany . 4,655 parts In-Stock

1+ parts

$8.673

100+ parts

$7.112

1k+ parts

-

10k+ parts

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4,655

$8.673

$7.112

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IDEA Electronic Components Group

UK . 451 parts In-Stock

1+ parts

$8.673

100+ parts

$8.239

1k+ parts

$7.806

10k+ parts

-

451

$8.673

$8.239

$7.806

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One Stop Electronics

USA . 1,111 parts In-Stock

1+ parts

$93.000

100+ parts

-

1k+ parts

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10k+ parts

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1,111

$93.000

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Corphita

USA . 4,183 parts In-Stock

1+ parts

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4,183

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Overview

Elevate your analog data transmission with the TCM4205AJ-00 by Texas Instruments. Crafted with precision and quality, this product offers seamless connectivity for a wide range of applications. From telecom to industrial automation, this versatile interface provides reliable performance and efficiency. Trust in Texas Instruments' reputation for excellence and elevate your projects with the TCM4205AJ-00. Discover the value and benefits this product brings to your work today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package ensures durability and protection for the components inside, making the product reliable for long-term use.

No. of Terminals: 28

Having 28 terminals allows for more connectivity options, making this product versatile for various applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand higher temperatures without affecting its performance, making it suitable for industrial environments.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides stable power to the product, ensuring consistent and reliable performance.

Telecom IC Type: SLIC

Being a Subscriber Line Interface Circuit (SLIC) type ensures compatibility with telecom systems, making this product a suitable choice for telecommunications applications.

Technical Specifications

Analog Data Transmission Interfaces TCM4205AJ-00 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-GDIP-T28

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TCM4205AJ-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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