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LE88266DLC

Microchip Technology

LE88266DLC by Microchip Technology

SLIC; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: HLQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

Median Price

$17.100

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 390 parts In-Stock

1+ parts

$17.100

100+ parts

$13.800

1k+ parts

-

10k+ parts

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390

$17.100

$13.800

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Electronics Depot

USA . 680 parts In-Stock

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-

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680

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ComSIT Distribution GmbH

Germany . 484 parts In-Stock

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484

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ComSIT USA

USA . 484 parts In-Stock

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484

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Prism Electronics

USA . 71 parts In-Stock

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71

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Distributors (Availability)

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XL Components Corporation

Australia . 6,504 parts In-Stock

1+ parts

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6,504

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QualityLine Systems

Poland . 6,331 parts In-Stock

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6,331

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Marpe Global Electronics

Taiwan . 5,429 parts In-Stock

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5,429

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Alle Elektronik GmbH

Germany . 4,501 parts In-Stock

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4,501

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Kepictronics

USA . 1,800 parts In-Stock

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1,800

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Assy Fe

Spain . 1,295 parts In-Stock

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1,295

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GreenTree Electronics

Israel . 450 parts In-Stock

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450

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Technical Specifications

Analog Data Transmission Interfaces LE88266DLC attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Microchip Technology

Specs

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

Maximum Noise:

19 dBrnC

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

40 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LE88266DLC Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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