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DS38EP100

Texas Instruments

DS38EP100 by Texas Instruments

DS38EP100 by Texas Instruments is a small outline analog data transmission interface with 6 terminals. It operates in industrial temperature range (-40 to 85°C) and features line equalizer telecom IC type. Suitable for surface mount applications, it has a rectangular package shape with very thin profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,962 parts In-Stock

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3,962

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Digiode

USA . 1,379 parts In-Stock

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1,379

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Anansix

USA . 549 parts In-Stock

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549

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Native Components

USA . 801 parts In-Stock

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$0.039

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$0.038

801

$0.039

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$0.038

Parana Technologies

USA . 2,065 parts In-Stock

1+ parts

$9.519

100+ parts

$884.024

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$8.567

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2,065

$9.519

$884.024

$8.567

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DigiPath Technology Company

USA . 1,980 parts In-Stock

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$10.482

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$9.644

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1,980

$10.482

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ChromeModa Solutions

Germany . 6,970 parts In-Stock

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$10.696

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$8.771

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6,970

$10.696

$8.771

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IDEA Electronic Components Group

UK . 1,175 parts In-Stock

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$10.696

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$10.161

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$9.626

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1,175

$10.696

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$9.626

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AZTECH Wire

Italy . 872 parts In-Stock

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$15.314

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872

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One Stop Electronics

USA . 1,252 parts In-Stock

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$27.000

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1,252

$27.000

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Corphita

USA . 4,894 parts In-Stock

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Northwest PG Solutions

USA . 1,473 parts In-Stock

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Perfect Parts

USA . 3 parts In-Stock

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Overview

Enhance your data transmission experience with the Texas Instruments DS38EP100. As a leader in analog data transmission interfaces, Texas Instruments ensures top-notch quality and reliability in every product. Whether you're working on telecommunications or industrial applications, this surface-mount device with a small outline package offers unparalleled performance and efficiency. With a wide operating temperature range and dual terminal position, the DS38EP100 provides value and benefits that exceed expectations. Upgrade to Texas Instruments for a seamless and enhanced data transmission experience.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, making it suitable for applications with limited space.

No. of Terminals: 6

Having 6 terminals allows for more flexibility in connecting the device to other components or systems.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures efficient heat dissipation and a slim profile, ideal for applications where space and thermal management are critical.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial applications where elevated temperatures may be present.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in harsh environments and ensures reliability under extreme conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity, making the device more reliable.

Maximum Seated Height: 0.8 mm

The low maximum seated height contributes to a slim and compact design, ideal for space-constrained applications.

Width: 2.2 mm

The small width enables easy integration into tight spaces, enhancing the versatility of the product.

Length: 2.5 mm

The compact length further contributes to the small form factor of the product, making it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments, making it a robust and durable choice.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and complies with regulations, making it a sustainable choice.

Telecom IC Type: LINE EQUALIZER

The line equalizer feature helps optimize signal quality and compensate for signal attenuation, enhancing data transmission reliability.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for dense PCB layouts, saving space and enabling high-speed data transmission.

Technical Specifications

Analog Data Transmission Interfaces DS38EP100 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-XDSO-N6

Length:

2.5 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

2.2 mm

Trade Compliance

DS38EP100 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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