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LE88286DLCT

Microsemi

LE88286DLCT by Microsemi

SLIC; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: HLQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Martec Srl

Italy . 7,000 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 688 parts In-Stock

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Nova Conductors

Japan . 19 parts In-Stock

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AZTECH Wire

Italy . 505 parts In-Stock

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$13.059

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Perfect Parts

USA . 114,240 parts In-Stock

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XL Components Corporation

Australia . 5,493 parts In-Stock

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Marpe Global Electronics

Taiwan . 3,122 parts In-Stock

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Continental Prestige Electronics

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QualityLine Systems

Poland . 1,540 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 200 parts In-Stock

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Microchip USA

USA . 158 parts In-Stock

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Technical Specifications

Analog Data Transmission Interfaces LE88286DLCT attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Microsemi

Specs

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

Maximum Noise:

19 dBrnC

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Power Supply Rejection Ratio (PSRR):

40 dB

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LE88286DLCT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microsemi

Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California.

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