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DS64EV400SQX

Texas Instruments

DS64EV400SQX by Texas Instruments

DS64EV400SQX by Texas Instruments is a 48-terminal analog data transmission interface with a square package shape. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of 2.5 V. Ideal for telecom applications as a line equalizer, this chip carrier features tin lead terminal finish and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,485 parts In-Stock

1+ parts

-

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4,485

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Vyrian

USA . 2,678 parts In-Stock

1+ parts

-

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2,678

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Anansix

USA . 344 parts In-Stock

1+ parts

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344

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 373 parts In-Stock

1+ parts

$10.009

100+ parts

-

1k+ parts

$10.570

10k+ parts

-

373

$10.009

-

$10.570

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AZTECH Wire

Italy . 328 parts In-Stock

1+ parts

$10.606

100+ parts

-

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328

$10.606

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DigiPath Technology Company

USA . 2,211 parts In-Stock

1+ parts

$11.021

100+ parts

$10.139

1k+ parts

-

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2,211

$11.021

$10.139

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ChromeModa Solutions

Germany . 2,067 parts In-Stock

1+ parts

$11.246

100+ parts

$9.222

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-

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2,067

$11.246

$9.222

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IDEA Electronic Components Group

UK . 1,689 parts In-Stock

1+ parts

$11.246

100+ parts

$10.684

1k+ parts

$10.121

10k+ parts

-

1,689

$11.246

$10.684

$10.121

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Native Components

USA . 370 parts In-Stock

1+ parts

$28.221

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370

$28.221

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Northwest PG Solutions

USA . 1,399 parts In-Stock

1+ parts

$31.043

100+ parts

$27.939

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1,399

$31.043

$27.939

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One Stop Electronics

USA . 1,528 parts In-Stock

1+ parts

$434.000

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1,528

$434.000

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Corphita

USA . 1,853 parts In-Stock

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1,853

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Overview

Enhance your analog data transmission capabilities with the DS64EV400SQX by Texas Instruments. Designed for industrial-grade applications, this line equalizer offers top-notch quality and reliability. With a compact square package shape and surface mount feature, this product provides customers with ease of installation and space-saving solutions. Trust in Texas Instruments' reputation for excellence in manufacturing to deliver a high-performance solution that meets your needs. Upgrade your telecom systems with the value and benefits of the DS64EV400SQX today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

The square package shape provides a compact footprint, ideal for applications where space is limited.

No. of Terminals: 48

Having 48 terminals allows for a high level of connectivity and functionality, making this product versatile for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows for use in both extreme cold and hot environments, enhancing the product's versatility.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring stable electrical connections.

Width: 7 mm

The compact width of 7mm makes this product suitable for applications where space is limited.

Length: 7 mm

The square package shape with a length of 7mm provides a balanced design and easy integration into circuit boards.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V is common in many electronic systems, making this product compatible with a wide range of applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is suitable for environments with moderate exposure to moisture, ensuring durability and reliability.

Technical Specifications

Analog Data Transmission Interfaces DS64EV400SQX attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DS64EV400SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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