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DS64EV400

Texas Instruments

DS64EV400 by Texas Instruments

DS64EV400 by Texas Instruments is a 48-terminal LINE EQUALIZER IC with 2.5V supply voltage, operating from -40 to 85°C. It features PLASTIC/EPOXY body material, SQUARE package shape, and 0.8mm seated height. Ideal for analog data transmission interfaces in industrial telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,435 parts In-Stock

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Digiode

USA . 2,252 parts In-Stock

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Anansix

USA . 1,343 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 999 parts In-Stock

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$0.923

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$0.923

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Northwest PG Solutions

USA . 1,979 parts In-Stock

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$1.015

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$1.015

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AZTECH Wire

Italy . 311 parts In-Stock

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$9.751

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311

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Parana Technologies

USA . 757 parts In-Stock

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$12.305

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$12.734

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757

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$12.734

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DigiPath Technology Company

USA . 14 parts In-Stock

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$13.549

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$13.549

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ChromeModa Solutions

Germany . 6,472 parts In-Stock

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$13.826

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$11.337

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IDEA Electronic Components Group

UK . 1,289 parts In-Stock

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$13.826

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$13.135

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$12.443

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One Stop Electronics

USA . 1,329 parts In-Stock

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$854.000

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Corphita

USA . 1,327 parts In-Stock

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Overview

Unlock a world of seamless analog data transmission with the Texas Instruments DS64EV400. Crafted by industry leader Texas Instruments, this cutting-edge line equalizer is designed to optimize signal integrity for your communication needs. From telecom applications to industrial settings, this versatile chip carrier promises reliable performance in a compact package. Experience the value of enhanced connectivity and superior quality with the DS64EV400 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and strength are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and making assembly easier.

Package Shape: SQUARE

The square package shape is compact and allows for efficient use of space on the circuit board.

No. of Terminals: 48

With a high number of terminals, this product can provide complex connectivity and functionality, making it suitable for advanced applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design offers enhanced thermal management, space-saving benefits, and improved performance in compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in a wide range of environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold environments, expanding the range of applications where this product can be used.

Terminal Position: QUAD

The quad terminal position provides enhanced connectivity options and allows for more versatile integration into circuit designs.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a slim profile and can be beneficial for applications where space constraints are a concern.

Width: 7 mm

The compact width enables easy placement on the circuit board and helps in optimizing the layout of the overall system.

Length: 7 mm

The compact length contributes to the overall space-saving design of the product, making it suitable for applications where size is a critical factor.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh operating conditions commonly found in industrial settings, enhancing its reliability and longevity.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and RoHS compliant, making it a sustainable choice for electronic designs.

Telecom IC Type: LINE EQUALIZER

The line equalizer telecom IC type enhances signal quality and transmission performance in telecom applications, making it a suitable choice for communication systems.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V is common in many electronic systems, providing compatibility and ease of integration into various designs.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density mounting and efficient use of space on the circuit board, making it ideal for compact designs.

Technical Specifications

Analog Data Transmission Interfaces DS64EV400 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DS64EV400 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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