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MAX3785ITT+

Analog Devices

MAX3785ITT+ by Analog Devices

MAX3785ITT+ by Analog Devices is a small outline, heat sink package with 6 terminals. It operates at 1.8V and has a max supply current of 0.055mA. Ideal for telecom applications as a line equalizer due to its very thin profile and dual terminal position.

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MAX3785ITT+ by Analog Devices
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Vyrian

USA . 4,583 parts In-Stock

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Digiode

USA . 3,115 parts In-Stock

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Anansix

USA . 1,991 parts In-Stock

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1,991

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AZTECH Wire

Italy . 422 parts In-Stock

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$6.773

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$6.773

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MARBEL Systems

Belgium . 3,181 parts In-Stock

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$11.434

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$11.434

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Texas Native Microelectronics

USA . 80 parts In-Stock

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$13.142

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$12.616

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$12.222

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$11.565

80

$13.142

$12.616

$12.222

$11.565

Kenton Components

USA . 90 parts In-Stock

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$15.770

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$13.878

90

$15.770

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$13.878

Qasali Group International

UK . 3,252 parts In-Stock

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$35.483

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$33.000

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$31.225

3,252

$35.483

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$31.225

Semicontronic

India . 930 parts In-Stock

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$388.000

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$378.300

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$376.360

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930

$388.000

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$376.360

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One Stop Electronics

USA . 1,267 parts In-Stock

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$817.000

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Corphita

USA . 1,875 parts In-Stock

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Overview

Enhance your data transmission capabilities with the MAX3785ITT+ by Analog Devices. Known for their superior quality and expertise in analog interfaces, Analog Devices delivers a product that offers unmatched value and benefits to customers. Whether you're looking to improve signal integrity in telecom applications or enhance communication systems, this small outline, heat sink design provides reliability and efficiency. Trust Analog Devices to elevate your data transmission experience with the MAX3785ITT+.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the interface.

Surface Mount: YES

Facilitates easy and efficient installation onto circuit boards.

Package Shape: SQUARE

Allows for compact and efficient layout on circuit boards.

Power Supplies (V): 1.8

Operates efficiently with a low power supply, reducing energy consumption.

No. of Terminals: 6

Provides multiple connection points for flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Enables a space-saving design and efficient heat dissipation.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -20 °C

Ideal for use in a wide range of temperature conditions.

Terminal Finish: MATTE TIN

Provides a stable and reliable connection for the terminals.

Terminal Position: DUAL

Allows for easy connectivity and compatibility in various circuit configurations.

Maximum Seated Height: 0.8 mm

Contributes to the overall slim profile of the interface.

Width: 3 mm

Compact width for efficient use of space on a circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Maintains stability and reliability during the reflow soldering process.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes without damage.

Length: 3 mm

Compact length for a space-saving design.

Terminal Form: NO LEAD

Environmentally friendly option compared to leaded terminals.

Maximum Supply Current: 0.055 mA

Operates efficiently with low current consumption.

Telecom IC Type: LINE EQUALIZER

Specifically designed for telecom applications to ensure optimal signal quality.

Nominal Supply Voltage: 1.8 V

Operates efficiently at a low voltage, reducing power consumption.

Terminal Pitch: 0.95 mm

Provides a compact layout for efficient circuit design.

Technical Specifications

Analog Data Transmission Interfaces MAX3785ITT+ attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Analog Devices

Specs

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

.055 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MAX3785ITT+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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