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MAX3785UTT+T

Analog Devices

MAX3785UTT+T by Analog Devices

MAX3785UTT+T by Analog Devices is a small outline, heat sink package with 6 terminals and a 1.8V supply voltage. It operates b/w 0-85 °C, consuming only 0.055mA of current, making it ideal for telecom applications as a line equalizer IC.

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3

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1k+

MAX3785UTT+T by Analog Devices
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Vyrian

USA . 8,398 parts In-Stock

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Digiode

USA . 3,300 parts In-Stock

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3,300

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Anansix

USA . 2,550 parts In-Stock

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2,550

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MARBEL Systems

Belgium . 530 parts In-Stock

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$6.158

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530

$6.158

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Texas Native Microelectronics

USA . 583 parts In-Stock

1+ parts

$7.078

100+ parts

$6.795

1k+ parts

$6.583

10k+ parts

$6.229

583

$7.078

$6.795

$6.583

$6.229

Kenton Components

USA . 1,000 parts In-Stock

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$8.494

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$7.474

1,000

$8.494

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$7.474

AZTECH Wire

Italy . 560 parts In-Stock

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$18.785

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Qasali Group International

UK . 3,794 parts In-Stock

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$19.111

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$17.773

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$16.817

3,794

$19.111

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$17.773

$16.817

One Stop Electronics

USA . 1,451 parts In-Stock

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$134.000

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$134.000

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Semicontronic

India . 673 parts In-Stock

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$582.000

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$567.450

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$564.540

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673

$582.000

$567.450

$564.540

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Metaverse IC Inc.

Canada . 6,708 parts In-Stock

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Kepictronics

USA . 5,310 parts In-Stock

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Corphita

USA . 2,833 parts In-Stock

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Overview

Enhance your data transmission experience with the MAX3785UTT+T by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-quality analog data transmission interfaces that are reliable and efficient. The MAX3785UTT+T is perfect for a wide range of applications, offering seamless connectivity and superior performance. With its compact size and advanced features, this product provides exceptional value and benefits to customers looking for high-quality solutions. Upgrade your systems with the MAX3785UTT+T and experience a new level of connectivity.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and automated assembly, making the product suitable for high volume manufacturing processes.

Package Shape: SQUARE

The square package shape helps in efficient utilization of board space and facilitates better heat dissipation.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8V helps in reducing power consumption and making the product energy-efficient.

No. of Terminals: 6

Having 6 terminals provides flexibility in connecting the interface to different components, allowing for versatile integration.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can perform reliably even under demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at as low as 0 °C ensures the product can function effectively in a wide range of temperature settings.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and conductivity, ensuring reliable electrical connections.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in circuit design and layout, accommodating different board configurations.

Maximum Seated Height: 0.8 mm

The low seated height of 0.8mm helps in minimizing the overall profile of the product and is suitable for compact electronic devices.

Width: 3 mm

The narrow width of 3mm enables space-efficient placement on the circuit board, allowing for dense PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short time requirement at peak reflow temperature of 260 °C ensures quick and reliable soldering during assembly.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and is safer for both users and the environment.

Maximum Supply Current: 0.055 mA

Operating at a low supply current of 0.055mA helps in minimizing power consumption and heat generation.

Telecom IC Type: LINE EQUALIZER

Being a line equalizer type makes the product suitable for telecommunications applications, providing signal conditioning and enhancing transmission quality.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V ensures compatibility with low-voltage systems and helps in achieving energy efficiency.

Terminal Pitch: 0.95 mm

The narrow terminal pitch of 0.95mm enables high-density mounting on the PCB and allows for compact circuit designs.

Technical Specifications

Analog Data Transmission Interfaces MAX3785UTT+T attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Analog Devices

Specs

JESD-30 Code:

S-XDSO-N6

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

.055 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MAX3785UTT+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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