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5962-8863603LA

Teledyne E2v (Uk)

5962-8863603LA by Teledyne E2v (Uk)

OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T24;

Median Price

$157.870

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

5962-8863603LA by Teledyne E2v (Uk)
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Nova Conductors

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AZTECH Wire

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Ampacity Inc.

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Aranea Global

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$154.713

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$148.524

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Continental Prestige Electronics

USA . 594 parts In-Stock

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Argo Parts USA

USA . 4,752 parts In-Stock

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4,752

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Technical Specifications

OTP ROM 5962-8863603LA attributes and parameters. Explore more OTP ROM devices from Teledyne E2v (Uk)

Specs

Maximum Access Time:

60 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T24

JESD-609 Code:

e0

Length:

31.877 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

1KX8

Output Characteristics:

REGISTERED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

12.5

Qualification:

Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Maximum Standby Current:

.12 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

5962-8863603LA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Teledyne E2v (Uk)

Teledyne e2v Innovators in semiconductors, high power RF, imaging, precision timing and engineered systems Our innovations enable our customers innovations through access to state-of-the-art technologies, driving the next generation of systems, in signal chain semiconductor devices, full spectrum imaging and high power radio frequency solutions. Teledyne e2v has an enviable history of employing some of the best minds who work with industry and academia in commercialising technologies of the future, developing high quality products, services and turn-key solutions produced through our world class global facilities that have real benefit to the world. Our teams passions have led to ground breaking improvements in cancer radiotherapy systems, ultra-high reliability in critical electronic systems and observing the effects of climate change from space

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