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CMS209-250

Texas Instruments

CMS209-250 by Texas Instruments

Texas Instruments' CMS209-250 is a 64KX16 OTP ROM with 60 terminals. Operating at 5V, it offers 3-STATE output and supports parallel mode. Ideal for commercial applications, this CMOS technology device has a max access time of 250ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,763 parts In-Stock

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5,763

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Digiode

USA . 3,510 parts In-Stock

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3,510

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Parana Technologies

USA . 1,241 parts In-Stock

1+ parts

$2.945

100+ parts

-

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$3.445

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1,241

$2.945

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$3.445

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DigiPath Technology Company

USA . 2,089 parts In-Stock

1+ parts

$3.243

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2,089

$3.243

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ChromeModa Solutions

Germany . 3,539 parts In-Stock

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$3.309

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$2.713

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3,539

$3.309

$2.713

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IDEA Electronic Components Group

UK . 1,254 parts In-Stock

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$3.309

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$2.978

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1,254

$3.309

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$2.978

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One Stop Electronics

USA . 963 parts In-Stock

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$5.000

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963

$5.000

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AZTECH Wire

Italy . 396 parts In-Stock

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$15.285

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396

$15.285

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Native Components

USA . 892 parts In-Stock

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$20.430

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$20.430

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Northwest PG Solutions

USA . 635 parts In-Stock

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$22.473

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$20.226

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635

$22.473

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Corphita

USA . 514 parts In-Stock

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Overview

Unlock endless possibilities with the CMS209-250 by Texas Instruments, a high-quality OTP ROM that offers unparalleled reliability and performance. Ideal for a wide range of applications, this versatile device operates asynchronously with common input/output type, providing seamless integration into your projects. With its 64KX16 organization and 3-STATE output characteristics, the CMS209-250 delivers fast access times and efficient operation. Trust in Texas Instruments' reputation for excellence and choose the CMS209-250 for superior value and unmatched benefits in your next design project.

Feature Benefit Bullets

Operating Mode: ASYNCHRONOUS

Allows for flexible and independent operation, increasing versatility.

Input/Output Type: COMMON

Simplifies connections and compatibility with other components.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply for simplicity and ease of use.

Organization: 64KX16

Provides a large memory capacity with 64K words and 16-bit width for efficient data storage.

Output Characteristics: 3-STATE

Enables the output to be in three states (low, high, and high impedance), adding flexibility in controlling signals.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Maximum Access Time: 250 ns

Ensures quick access to data, enhancing performance and efficiency.

Technical Specifications

OTP ROM CMS209-250 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

250 ns

Input/Output Type:

COMMON

JESD-30 Code:

X-XXMA-X60

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

60

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX16

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

CARD60

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.007 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

UNSPECIFIED

Terminal Position:

UNSPECIFIED

Trade Compliance

CMS209-250 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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