Loading...

5962-01-188-9092

Texas Instruments

5962-01-188-9092 by Texas Instruments

Texas Instruments' 5962-01-188-9092 is a MILITARY-grade OTP ROM with 512x8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,405

-

-

-

-

Digiode

USA . 2,414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,414

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 64 parts In-Stock

1+ parts

$2.606

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$2.606

-

-

-

Parana Technologies

USA . 2,062 parts In-Stock

1+ parts

$2.991

100+ parts

-

1k+ parts

$3.496

10k+ parts

-

2,062

$2.991

-

$3.496

-

ChromeModa Solutions

Germany . 2,454 parts In-Stock

1+ parts

$3.361

100+ parts

$2.756

1k+ parts

-

10k+ parts

-

2,454

$3.361

$2.756

-

-

IDEA Electronic Components Group

UK . 1,311 parts In-Stock

1+ parts

$3.361

100+ parts

-

1k+ parts

$3.025

10k+ parts

-

1,311

$3.361

-

$3.025

-

One Stop Electronics

USA . 403 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

10k+ parts

-

403

$9.000

-

-

-

AZTECH Wire

Italy . 588 parts In-Stock

1+ parts

$14.318

100+ parts

-

1k+ parts

-

10k+ parts

-

588

$14.318

-

-

-

Corphita

USA . 2,965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,965

-

-

-

-

DigiPath Technology Company

USA . 1,042 parts In-Stock

1+ parts

-

100+ parts

$3.030

1k+ parts

-

10k+ parts

-

1,042

-

$3.030

-

-

Native Components

USA . 501 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.298

10k+ parts

-

501

-

-

$2.298

-

Overview

Unlock the power of secure and reliable data storage with the 5962-01-188-9092 OTP ROM by Texas Instruments. Designed with precision and quality in mind, this military-grade memory IC offers a seamless solution for critical applications in harsh environments. With a wide operating temperature range and fast access time, this product ensures optimal performance and durability. Trust Texas Instruments to provide you with the cutting-edge technology and peace of mind that your data is safe and accessible when you need it most. Choose the 5962-01-188-9092 for unmatched reliability and efficiency in your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent protection for the internal components of the device, making it highly durable and reliable.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V ensures compatibility with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this OTP ROM suitable for use in harsh environments or applications that require extended temperature ranges.

Memory Width: 8

With a memory width of 8 bits, this OTP ROM can handle a larger amount of data, making it ideal for storing and retrieving information efficiently.

Technology: TTL

The use of TTL technology ensures fast and reliable data transmission, making this OTP ROM a high-performance solution for various applications.

Memory Density: 4096 bit

The high memory density allows for storing a large amount of data in a compact form factor, making this OTP ROM a cost-effective choice for memory-intensive applications.

Maximum Access Time: 85 ns

The fast access time of 85 ns enables quick data retrieval, making this OTP ROM suitable for applications that require rapid response times.

Technical Specifications

OTP ROM 5962-01-188-9092 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

85 ns

JESD-30 Code:

R-XDIP-T20

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

20

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

512X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-188-9092 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20