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TBP24SA41NP1

Texas Instruments

TBP24SA41NP1 by Texas Instruments

TBP24SA41NP1 by Texas Instruments is a 1KX4 OTP ROM with 4096-bit memory density and 60 ns max access time. It features TTL technology, operates b/w 0-70°C, and has an IN-LINE package style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,973 parts In-Stock

1+ parts

-

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5,973

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Digiode

USA . 2,347 parts In-Stock

1+ parts

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2,347

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,017 parts In-Stock

1+ parts

$4.757

100+ parts

-

1k+ parts

$5.262

10k+ parts

-

2,017

$4.757

-

$5.262

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DigiPath Technology Company

USA . 1,747 parts In-Stock

1+ parts

$5.238

100+ parts

-

1k+ parts

-

10k+ parts

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1,747

$5.238

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ChromeModa Solutions

Germany . 4,419 parts In-Stock

1+ parts

$5.345

100+ parts

$4.383

1k+ parts

-

10k+ parts

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4,419

$5.345

$4.383

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IDEA Electronic Components Group

UK . 1,396 parts In-Stock

1+ parts

$5.345

100+ parts

-

1k+ parts

$4.810

10k+ parts

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1,396

$5.345

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$4.810

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AZTECH Wire

Italy . 833 parts In-Stock

1+ parts

$13.786

100+ parts

-

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833

$13.786

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One Stop Electronics

USA . 157 parts In-Stock

1+ parts

$19.000

100+ parts

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157

$19.000

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Corphita

USA . 1,124 parts In-Stock

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1,124

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Overview

Discover the TBP24SA41NP1 by Texas Instruments, a high-quality OTP ROM that offers reliability and performance like no other. Manufactured by Texas Instruments, a renowned leader in the industry, this product is perfect for a wide range of applications. With its advanced technology and commercial-grade temperature grade, this OTP ROM provides exceptional value to customers seeking reliable memory solutions. Experience the benefits of seamless operation and fast access times with the TBP24SA41NP1, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the inner components of the OTP ROM, making it long-lasting and reliable.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices, providing versatile usage options.

No. of Terminals: 18

Having 18 terminals provides a sufficient number of connection points for interfacing with other components in a circuit, ensuring efficient communication.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this OTP ROM can function effectively even in demanding environments.

Organization: 1KX4

1KX4 organization means the OTP ROM has a capacity of 1024 words with a width of 4, providing ample memory storage for data.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of digital systems, making it a versatile choice for various applications.

Memory IC Type: OTP ROM

OTP ROM (One-Time Programmable Read-Only Memory) offers permanent data storage, making it ideal for applications where data does not need to be changed frequently.

Technical Specifications

OTP ROM TBP24SA41NP1 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

60 ns

JESD-30 Code:

R-PDIP-T18

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TBP24SA41NP1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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