Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments CBP28S42MJ is a MIL-STD-883 Class B OTP ROM with 512x8 organization, 4096-bit memory density, and 60ns max access time. Ideal for military applications requiring reliable data storage in harsh environments.
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Parana Technologies
$2.990
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DigiPath Technology Company
$3.293
$3.029
ChromeModa Solutions
$3.360
$2.755
IDEA Electronic Components Group
$3.024
Native Components
$14.248
Northwest PG Solutions
$15.673
$14.106
AZTECH Wire
$17.789
One Stop Electronics
$26.000
Corphita
Ceramic package body material provides outstanding durability and reliability, making this OTP ROM suitable for rugged environments and long-term use.
Operating at a standard 5V supply voltage ensures compatibility with many existing systems and makes integration easier.
With a high maximum operating temperature of 125°C, this OTP ROM can perform reliably in demanding thermal conditions.
The 512X8 organization provides a good balance of capacity and access speed, suitable for storing and retrieving moderate amounts of data efficiently.
Being based on TTL technology ensures fast and reliable signal processing, making this OTP ROM ideal for applications requiring quick access times.
OTP ROM CBP28S42MJ attributes and parameters. Explore more OTP ROM devices from Texas Instruments
Maximum Access Time:
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Terminals:
No. of Words:
No. of Words Code:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Screening Level:
Sub-Category:
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
CBP28S42MJ Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Plessey Semiconductors Discrete Components Div
Other Transistors;
1N4148
Unitrode
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ERJU06F10R0V
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
Vicor
EU2B-YS3103F
Idec
ROTARY SWITCH;
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
ECA2DHG4R7
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
Motorola
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; JESD-609 Code: e0;
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Goodwork Semiconductor
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
AT27C256R-70JUSL383
AT27C256R-70JUSL383 by Microchip is a 32Kx8 OTP ROM with 70ns access time, operating at 5V. It features asynchronous operation, separate I/O type, and parallel interface. Ideal for applications requiring non-volatile memory storage in a compact chip carrier package.
JBP28SA46MJW
Texas Instruments
JBP28SA46MJW by Texas Instruments is a MILITARY-grade OTP ROM with 512x8 organization, 4096-bit memory density, and 75ns max access time. It is ideal for applications requiring reliable non-volatile memory storage in harsh environments.
HS1-6664RH-Q
Harris Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
SN54S188J
SN54S188J by Texas Instruments is a 32x8 OTP ROM IC with 50ns max access time, operating b/w -55 to 125°C. It has a supply voltage of 5V and consumes up to 110mA. This MIL-grade TTL technology chip comes in a ceramic rectangular package for military applications.
TBP24SA41J
TBP24SA41J by Texas Instruments is an OTP ROM with 1KX4 organization, operating at 5V. It features a memory density of 4096 bit and max access time of 60ns. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.
AT27C256R-70JI
Atmel
Atmel's AT27C256R-70JI is a 32Kx8 OTP ROM with 70ns access time, operating at 5V. It features asynchronous mode, 3-STATE output, and industrial temperature grade. Commonly used in applications requiring non-volatile memory storage with parallel interface.
SN74S470J4
SN74S470J4 by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grades. This TTL technology chip with through-hole terminals is ideal for applications requiring non-volatile memory storage.
BQ2022ADBZRG4
BQ2022ADBZRG4 by Texas Instruments is an OTP ROM with 1KX1 organization, operating at 2.7V nominal voltage. It features a small outline package style and operates in serial mode. Ideal for applications requiring low power consumption and compact design in temperature-sensitive environments.
Renesas Electronics
HS1-6664RH-Q by Renesas Electronics is a MILITARY-grade OTP ROM with 8KX8 organization, 8192 words, and 65536 bit memory density. It operates in ASYNCHRONOUS mode at temperatures ranging from -55 to 125 °C. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
TBP24SA81NP1
TBP24SA81NP1 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 70ns max access time. It features a rectangular package style, through-hole terminal form, and operates b/w 0°C to 70°C. Ideal for applications requiring non-volatile memory storage in commercial-grade temperature environments.
SN74S2708J
SN74S2708J by Texas Instruments is a 1Kx8 OTP ROM with 8192-bit memory density. It operates at temperatures from 0 to 70°C, with a max access time of 70ns. Ideal for commercial applications requiring reliable TTL technology in an in-line package style.
M27C512-15C1
M27C512-15C1 by STMicroelectronics is a 64KX8 OTP ROM chip with 150 ns access time and 3-STATE output. Operating at 5V, it has a memory density of 524288 bit and is ideal for applications requiring non-volatile memory storage in commercial temperature environments.
5962-01-188-6439
Texas Instruments' 5962-01-188-6439 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85 ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
5962-01-270-0223
Texas Instruments' 5962-01-270-0223 is a 1KX8 OTP ROM with 8192-bit memory density. Operating at 5V, it has a max access time of 65ns and operates in commercial temperature grade. This rectangular package with 24 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
BQ2024DBZRG4
BQ2024DBZRG4 by Texas Instruments is a small outline, thin profile OTP ROM with 1.5Kx1 organization and 1536-bit memory density. It operates asynchronously at temperatures ranging from -20 to 70°C, making it suitable for low-power applications requiring common I/O type and open-drain output characteristics. The device features a serial interface, dual-terminal position, and nickel/palladium/gold terminal finish for reliable performance in various electronic systems.
TBP18SA22MJ
TBP18SA22MJ by Texas Instruments is a MILITARY-grade OTP ROM with 256x8 organization and 2048-bit memory density. Featuring a 5V nominal voltage, it operates b/w -55 to 125 °C, with a max access time of 80 ns. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
TBP28L86J4
TBP28L86J4 by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density and 130 ns max access time. It operates at a nominal voltage of 5V, suitable for commercial temperature grade applications. The package style is in-line rectangular ceramic with 24 terminals in dual position through-hole form.
CY7C291A-35DMB
Teledyne E2v (uk)
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Width: 7.62 mm;
5962-01-242-6201
Texas Instruments' 5962-01-242-6201 is a MILITARY-grade OTP ROM with 1KX4 organization, 4096-bit memory density, and 75ns max access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory in harsh environments.
DS2502X1+
Maxim Integrated
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Code: VBGA; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CBP28SA166MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;
CBP28L86MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
CBP24SA10MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
CBP28S45MJ
CBP28P42MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;
CBP28L42MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Screening Level: MIL-STD-883 Class B (Modified);
CBP28SA86-60MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
CBP24S41MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Technology: TTL;
CBP28LA22MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 80 ns;
CBP24SA41MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 4096 bit;
CBP28R165MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T24;
CBP28L22MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP20,.3;
CBP28S46MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 4096 bit;
CBP24S81MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 8192 bit;
CBP28L45MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
CBP24S10MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
CBP24S81-55MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
CBP24SA81-55MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP18,.3;
CBP28S166-55MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 55 ns;
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