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SN74S476NP1

Texas Instruments

SN74S476NP1 by Texas Instruments

SN74S476NP1 by Texas Instruments is a 5V OTP ROM with 1KX4 organization and 4096-bit memory density. It features TTL technology, operates b/w 0-70°C, and has an IN-LINE package style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,987

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-

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Digiode

USA . 2,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,110

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 340 parts In-Stock

1+ parts

$4.012

100+ parts

-

1k+ parts

$4.477

10k+ parts

-

340

$4.012

-

$4.477

-

DigiPath Technology Company

USA . 173 parts In-Stock

1+ parts

$4.418

100+ parts

$4.064

1k+ parts

-

10k+ parts

-

173

$4.418

$4.064

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ChromeModa Solutions

Germany . 2,654 parts In-Stock

1+ parts

$4.508

100+ parts

$3.697

1k+ parts

-

10k+ parts

-

2,654

$4.508

$3.697

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IDEA Electronic Components Group

UK . 478 parts In-Stock

1+ parts

$4.508

100+ parts

-

1k+ parts

$4.057

10k+ parts

-

478

$4.508

-

$4.057

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One Stop Electronics

USA . 1,598 parts In-Stock

1+ parts

$12.000

100+ parts

-

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10k+ parts

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1,598

$12.000

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AZTECH Wire

Italy . 684 parts In-Stock

1+ parts

$15.939

100+ parts

-

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10k+ parts

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684

$15.939

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Corphita

USA . 4,249 parts In-Stock

1+ parts

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100+ parts

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4,249

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Overview

Elevate your electronic projects with the SN74S476NP1 from Texas Instruments. Crafted with precision and quality, this OTP ROM offers unparalleled reliability and performance. Perfect for a wide range of applications, this product is designed to meet the needs of today's tech-savvy consumers. With a focus on value and innovation, Texas Instruments delivers cutting-edge solutions that empower you to create without limits. Experience the advantages of this top-of-the-line product and unlock endless possibilities in your designs. Upgrade your projects with the SN74S476NP1 and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with most systems and ease of integration.

No. of Terminals: 18

Having 18 terminals allows for sufficient connectivity options and flexibility in system design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments.

Memory Density: 4096 bit

The high memory density of 4096 bits allows for storing a large amount of data in a compact form.

Memory IC Type: OTP ROM

Being an OTP ROM type memory IC ensures that the data stored is non-volatile and can only be programmed once, providing security and reliability.

Technical Specifications

OTP ROM SN74S476NP1 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T18

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74S476NP1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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