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SN74188AJ

Texas Instruments

SN74188AJ by Texas Instruments

SN74188AJ by Texas Instruments is a 32x8 OTP ROM IC with 50ns access time, operating at 5V. It features a ceramic rectangular package with 16 terminals in an in-line style. Ideal for commercial applications requiring fast memory access and reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,744 parts In-Stock

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7,744

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Digiode

USA . 2,426 parts In-Stock

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2,426

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LittleDiode

UK . 6 parts In-Stock

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6

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ECAB

Sweden . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,609 parts In-Stock

1+ parts

$2.399

100+ parts

-

1k+ parts

$2.897

10k+ parts

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1,609

$2.399

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$2.897

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ChromeModa Solutions

Germany . 2,403 parts In-Stock

1+ parts

$2.696

100+ parts

$2.211

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2,403

$2.696

$2.211

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IDEA Electronic Components Group

UK . 1,716 parts In-Stock

1+ parts

$2.696

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$2.426

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1,716

$2.696

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$2.426

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One Stop Electronics

USA . 1,143 parts In-Stock

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$4.000

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1,143

$4.000

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AZTECH Wire

Italy . 209 parts In-Stock

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$10.310

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209

$10.310

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Corphita

USA . 4,269 parts In-Stock

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4,269

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DigiPath Technology Company

USA . 838 parts In-Stock

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$2.431

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838

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$2.431

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Overview

Upgrade your electronic devices with the SN74188AJ by Texas Instruments, a high-quality OTP ROM that offers reliable performance and versatility. With its durable ceramic package and advanced TTL technology, this component is perfect for a wide range of applications. From consumer electronics to industrial automation, this product provides fast access times and low power consumption, ensuring seamless operation and efficient functionality. Trust Texas Instruments for top-notch components that deliver value and innovation to your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body provides excellent durability and reliability, making this OTP ROM suitable for applications in harsh environments.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with a wide range of systems and power sources.

Organization: 32X8

With a 32-word organization and a memory width of 8, this OTP ROM offers sufficient storage capacity for storing program instructions.

Technology: TTL

Utilizing TTL technology allows for fast and efficient processing of data, making this OTP ROM suitable for high-speed applications.

Maximum Access Time: 50 ns

With a maximum access time of 50 ns, this OTP ROM provides quick retrieval of data, ideal for time-sensitive operations.

Technical Specifications

OTP ROM SN74188AJ attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

50 ns

JESD-30 Code:

R-XDIP-T16

Memory IC Type:

Memory Width:

8

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

110 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74188AJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

NSN

5962-01-035-5405, 5962010355405

NIIN

010355405

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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