Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments SNC54S475W is a MIL-STD-883 Class B OTP ROM with 512x8 organization, 4096-bit memory density, and 85ns max access time. Ideal for military applications due to its MILITARY temperature grade and flatpack package style.
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$2.143
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$7.000
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$10.856
Corphita
Ceramic packaging provides excellent thermal conductivity and durability, ensuring reliable performance in harsh environments.
Ease of installation and integration on circuit boards, saving time and cost in manufacturing processes.
Meets military standards for reliable operation in demanding applications, ensuring quality and performance.
Compact and space-efficient design for easy placement and mounting on PCBs.
Sufficient number of terminals for connecting to external circuitry and interfaces, offering versatility in applications.
Flatpack design allows for efficient heat dissipation and compact layout on circuit boards.
High operating temperature tolerance for operation in extreme conditions without compromising performance.
Organized as 512 words of 8 bits each, providing a good balance of memory capacity and data width for various applications.
Low operating temperature limit ensures functionality in cold environments or under temperature fluctuations.
Dual terminal position for enhanced connectivity and signal routing in complex electronic systems.
Military-grade temperature specifications ensure reliable performance in critical and harsh environments.
TTL technology offers fast switching speeds and low power consumption, making it suitable for high-speed data processing applications.
Flat terminal design for easy soldering and secure connections in circuit assembly.
Low supply current requirement for efficient power consumption and extended battery life in portable devices.
Ample memory capacity for storing and processing data in a wide range of applications.
8-bit memory width allows for flexible data handling and manipulation, supporting various data formats and operations.
Fine terminal pitch for compact layout and high-density integration on circuit boards, saving space and enabling complex designs.
512 words code for efficient addressing and access to data within the memory array.
High memory density for storing a large amount of data in a small footprint, ideal for space-constrained applications.
One-Time Programmable Read-Only Memory (OTP ROM) offers secure and permanent data storage, ensuring data integrity and preventing unauthorized changes.
Fast access time for quick retrieval of data, supporting high-speed data processing and real-time applications.
OTP ROM SNC54S475W attributes and parameters. Explore more OTP ROM devices from Texas Instruments
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No. of Words Code:
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Minimum Operating Temperature:
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SNC54S475W Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N2222A
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
Hitano Enterprise
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW06031K00FKEAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06031K00FKEAHP is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.33 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance and operating voltage of 75 V.
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Leshan Radio
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
Dc Components
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
LL4148
Synsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1554216004
Molex
WIRE AND CABLE;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Panjit International
CBP18S46MJ
Texas Instruments
CBP18S46MJ by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 512x8 organization, 4096-bit memory density, and 85ns max access time. Ideal for military applications due to its MILITARY temperature grade and ceramic package body material.
SN74S188NP3
SN74S188NP3 by Texas Instruments is a 32x8 OTP ROM with 40ns max access time, operating at 5V. It has 16 terminals in an IN-LINE package style and uses TTL technology. Ideal for commercial applications requiring non-volatile memory storage.
SN74S3708J4
SN74S3708J4 by Texas Instruments is a 1Kx8 OTP ROM IC with 8192-bit memory density. Operating b/w 0°C to 70°C, it features TTL technology and a rectangular ceramic package style with 24 terminals. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.
JBP34SA16XMFK
The Texas Instruments JBP34SA16XMFK is a 4KX4 OTP ROM chip carrier with 20 terminals and 4096 words memory width. Operating b/w -55 to 125 °C, it's ideal for military-grade applications requiring high-density memory storage in a compact square ceramic package.
TBP24SA10J
TBP24SA10J by Texas Instruments is a 256x4 OTP ROM with 1024-bit memory density. Operating at 5V, it has a max access time of 65ns and operates in parallel mode. Ideal for commercial applications requiring fast and reliable non-volatile memory storage.
FM27C256V90
Fairchild Semiconductor
FM27C256V90 by Fairchild Semiconductor is a 32KX8 OTP ROM with 3-STATE output, operating at 5V. It features a max access time of 90ns and memory density of 262144 bit. Commonly used in commercial applications requiring non-volatile memory storage.
5962-8765102LA
Qp Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
FM27C256V120
FM27C256V120 by Fairchild Semiconductor is a 32KX8 OTP ROM with 3-STATE output, operating at 5V. It features a programming voltage of 12.75V and offers fast access time of 120ns. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.
5962-01-218-9268
Texas Instruments' 5962-01-218-9268 is a MILITARY-grade OTP ROM with 1KX8 organization, 8192-bit memory density, and 175 ns access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory in harsh environments.
TBP18SA030N
TBP18SA030N by Texas Instruments is a 256-bit OTP ROM with 32x8 organization, operating at 5V. It features an access time of 40ns, suitable for commercial applications requiring fast and reliable non-volatile memory storage in a rectangular plastic/epoxy package.
AT27C040-15RC
Atmel
AT27C040-15RC by Atmel is a 512KX8 OTP ROM with 150 ns access time, operating at 5V. It features a 3-STATE output and GULL WING terminal form. Ideal for applications requiring fast and reliable non-volatile memory storage in commercial temperature environments.
5962-01-225-9118
Texas Instruments' 5962-01-225-9118 is a 512x8 OTP ROM with 4096-bit memory density. It operates at 5V, has a max access time of 75ns, and supports TTL technology. This rectangular ceramic package with 20 terminals is ideal for commercial applications requiring non-volatile memory storage.
5962-01-186-0378
Texas Instruments' 5962-01-186-0378 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
HM1-7621A-8
Intersil
Intersil's HM1-7621A-8 is a MILITARY-grade OTP ROM with 512X4 organization, 2048-bit memory density, and 70ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
SN74S477N3
SN74S477N3 by Texas Instruments is a 1KX4 OTP ROM IC with 4096-bit memory density. Operating b/w 0°C to 70°C, it features TTL technology and comes in an IN-LINE package style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.
SN74S471J
SN74S471J by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and consumes up to 155mA. This TTL technology chip in ceramic package is ideal for commercial applications requiring non-volatile memory storage.
CBP28R165MJ
The Texas Instruments CBP28R165MJ is a MIL-STD-883 Class B OTP ROM with 2KX8 organization and 16384-bit memory density. It operates b/w -55 to 125 °C, making it ideal for military applications requiring reliable TTL technology in a ceramic package. With 24 terminals in an in-line rectangular shape, this device offers secure data storage and retrieval capabilities.
HS9-6664RH-Q
Renesas Electronics
HS9-6664RH-Q by Renesas Electronics is a MILITARY-grade OTP ROM with 8KX8 organization, 8192 words, and 65536 bit memory density. It operates at temperatures ranging from -55 to 125 °C and has a supply voltage of 4.5V to 5.5V. Ideal for military applications requiring reliable non-volatile memory storage in harsh environments.
AT27C1024-12JC
Atmel's AT27C1024-12JC is a 64KX16 OTP ROM with 120ns access time, operating at 5V. It features 3-STATE output and common I/O type, suitable for applications requiring reliable non-volatile memory storage in commercial-grade environments. The chip carrier package style with J bend terminals makes it ideal for space-constrained designs.
SN74S479N1
SN74S479N1 by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density and TTL technology. It operates b/w 0-70°C, has 24 terminals in an IN-LINE package style, and is ideal for applications requiring non-volatile memory storage.
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
SNC54186J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T24;
SNC54186W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Package Style (Meter): FLATPACK;
SNC54S188J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 32 words;
SNC54S188W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
SNC54S2708J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
SNC54S3708J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 1K;
SNC54S470J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;
SNC54S471J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 256;
SNC54S472J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 512 words;
SNC54S473J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Technology: TTL;
SNC54S474J
SNC54S474W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Surface Mount: YES;
SNC54S475J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 512X8;
SNC54S476J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
SNC54S477J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;
SNC54S478J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns;
SNC54S479J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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