Loading...

SNC54S475J

Texas Instruments

SNC54S475J by Texas Instruments

The Texas Instruments SNC54S475J is a MIL-STD-883 Class B OTP ROM with 512x8 organization and 4096-bit memory density. Operating b/w -55°C to 125°C, it has a max access time of 85ns. Ideal for military applications requiring reliable data storage in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,006

-

-

-

-

Digiode

USA . 2,553 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,553

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 598 parts In-Stock

1+ parts

$1.880

100+ parts

-

1k+ parts

$2.425

10k+ parts

-

598

$1.880

-

$2.425

-

DigiPath Technology Company

USA . 1,132 parts In-Stock

1+ parts

$2.070

100+ parts

$1.904

1k+ parts

-

10k+ parts

-

1,132

$2.070

$1.904

-

-

IDEA Electronic Components Group

UK . 2,043 parts In-Stock

1+ parts

$2.112

100+ parts

-

1k+ parts

$1.901

10k+ parts

-

2,043

$2.112

-

$1.901

-

ChromeModa Solutions

Germany . 1,272 parts In-Stock

1+ parts

$2.112

100+ parts

$1.732

1k+ parts

-

10k+ parts

-

1,272

$2.112

$1.732

-

-

AZTECH Wire

Italy . 370 parts In-Stock

1+ parts

$5.864

100+ parts

-

1k+ parts

-

10k+ parts

-

370

$5.864

-

-

-

One Stop Electronics

USA . 507 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

-

507

$14.000

-

-

-

Corphita

USA . 65 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the SNC54S475J by Texas Instruments. Crafted with precision and quality, this OTP ROM offers unparalleled performance and reliability for a wide range of applications. From aerospace to industrial automation, this product is designed to meet the demands of the most rigorous environments. Trust in the expertise of Texas Instruments to deliver unmatched value and innovation to your projects. Elevate your designs with the SNC54S475J and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body provides excellent thermal stability and reliability, making this product suitable for rugged environments.

Screening Level: MIL-STD-883 Class B (Modified)

The MIL-STD-883 Class B screening ensures high quality and reliability of the product, meeting stringent military standards.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this OTP ROM can withstand high temperature environments, making it suitable for a variety of applications.

Organization: 512X8

The 512X8 organization provides a total of 512 words each with 8 memory bits, offering sufficient storage capacity for data.

Technology: TTL

Using TTL technology ensures high-speed data processing and reliable performance, making this OTP ROM a good choice for demanding applications.

Maximum Access Time: 85 ns

The maximum access time of 85 nanoseconds ensures quick data retrieval, making this OTP ROM suitable for applications requiring fast response times.

Technical Specifications

OTP ROM SNC54S475J attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

85 ns

JESD-30 Code:

R-XDIP-T24

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

512X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

OTP ROMs

Maximum Supply Current:

155 mA

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54S475J Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 17