Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments SNC54S474W is a MIL-STD-883 Class B OTP ROM with 512x8 organization, 4096-bit memory density, and 85ns max access time. Ideal for military applications due to its MILITARY temperature grade and flatpack package style.
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Ceramic packages provide excellent durability and thermal conductivity, making this OTP ROM resistant to high temperatures and mechanical stress.
Being surface mountable makes this OTP ROM easy to integrate into circuit boards, saving space and simplifying assembly processes.
This OTP ROM undergoes rigorous testing and screening processes according to military standards, ensuring high reliability and performance in demanding environmental conditions.
Rectangular shape allows for efficient placement and routing of traces on PCBs, optimizing space utilization and signal integrity.
With a high maximum operating temperature, this OTP ROM can function reliably in harsh operating conditions without compromising performance.
High memory density allows for storage of a large number of data and program instructions in a compact form, suitable for various applications.
Using TTL technology ensures compatibility with a wide range of digital systems and interfaces, allowing for easy integration and communication with other components.
OTP ROM SNC54S474W attributes and parameters. Explore more OTP ROM devices from Texas Instruments
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No. of Words:
No. of Words Code:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
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Package Style (Meter):
Power Supplies (V):
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Nominal Supply Voltage / Vsup (V):
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SNC54S474W Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Nte Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
MURS160T3G
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
2N7002
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
AT27C256R-70JU-T
Microchip Technology
AT27C256R-70JU-T by Microchip: 32KX8 OTP ROM with 70 ns access time, 5V supply voltage, and 3-STATE output. Ideal for industrial applications requiring non-volatile memory storage in a compact chip carrier package.
TBP18S46NP3
TBP18S46NP3 by Texas Instruments is a 512x8 OTP ROM with memory density of 4096 bit. It operates at 5V, has a max access time of 75ns, and features a package style of IN-LINE. Ideal for commercial applications requiring reliable non-volatile memory storage in a compact rectangular package.
TBP28L22N1
TBP28L22N1 by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grades. This rectangular package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
5962-8765102LA
Qp Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
TBP28L85N
TBP28L85N by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density. Operating at 5V, it has a temperature range of 0-70°C and comes in a 24-terminal IN-LINE package. Ideal for commercial applications requiring TTL technology and through-hole terminals with a pitch of 2.54mm.
DS2502P-E48+T&R
Analog Devices
Analog Devices' DS2502P-E48+T&R is a 1KX1 OTP ROM with 1024-bit memory density. Operating at 3/5V, it features asynchronous mode and serial I/O. Ideal for industrial applications, this small outline package has a temperature range of -40 to 85°C.
SNC54S471J
SNC54S471J by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 256x8 organization, 2048-bit memory density, and 80ns max access time. Ideal for military applications due to its TTL technology, -55 to 125°C operating range, and ceramic package.
AT27C512R-15PC
Atmel
AT27C512R-15PC by Atmel is a 64KX8 OTP ROM with 150 ns access time, operating at 5V. It is commonly used in applications requiring non-volatile memory storage and has a package style of IN-LINE.
AT27C256R-45JU-T
AT27C256R-45JU-T by Microchip is a 32KX8 OTP ROM with 3-STATE output, operating at -40 to 85 °C. It features a programming voltage of 13V and max access time of 45ns. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact chip carrier package.
JBP34S162-30MJ
JBP34S162-30MJ by Texas Instruments is a MILITARY-grade OTP ROM with 4KX4 organization, 16384 bit memory density, and 4096 words. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
DS2505P+
Maxim Integrated
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
DS2502-E48+
Analog Devices' DS2502-E48+ is a 1KX1 OTP ROM with 1024-bit memory density. It operates in asynchronous mode with common I/O type and has a max supply voltage of 6V. Ideal for industrial applications, it features a cylindrical package style and operates b/w -40°C to 85°C temperature range.
5962-01-218-8485
Texas Instruments' 5962-01-218-8485 is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in commercial temperature grade. Ideal for applications requiring non-volatile memory storage in industrial settings.
AT27C4096-90JU
AT27C4096-90JU by Microchip Technology is a 256KX16 OTP ROM with 90 ns access time, operating at 5V. It features a 44-terminal chip carrier package and supports asynchronous operation. Ideal for industrial applications requiring non-volatile memory storage in a compact form factor.
DS2406P/T&R
DS2406P/T&R by Maxim Integrated is a 1Kx1 OTP ROM with 1024-bit memory density. Operating at 3V, it features a small outline package and industrial temperature grade. Suitable for applications requiring asynchronous operation and serial communication, it has a terminal pitch of 1.27mm and C-bend terminal form.
SN74S474J4
SN74S474J4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 75ns. This IC, housed in a ceramic rectangular package, is ideal for commercial applications requiring reliable non-volatile memory storage.
AT27C256R-12JC
AT27C256R-12JC by Atmel is a 32KX8 OTP ROM with 3-STATE output, operating at 5V. It has a max access time of 120ns and is ideal for commercial applications requiring parallel memory technology. The chip carrier package style with J BEND terminals makes it suitable for surface mount assembly.
AT27C512R-70PC
AT27C512R-70PC by Atmel is a 64KX8 OTP ROM with 70ns access time, operating at 5V. It features a 3-STATE output and operates in parallel mode. Commonly used in commercial applications requiring non-volatile memory storage with a memory density of 524288 bits.
TBP28L85J4
TBP28L85J4 by Texas Instruments is a 1Kx8 OTP ROM with 8192-bit memory density and operates at a nominal voltage of 5V. This rectangular ceramic package has 24 terminals, dual terminal position, and TTL technology. It is ideal for commercial applications requiring non-volatile memory storage in a compact IN-LINE package style.
DS1982-F3+
DS1982-F3+ by Analog Devices is a 1KX1 OTP ROM with 1024-bit memory density. Operating at 5V, it has an access time of 15000 ns and is ideal for industrial applications requiring asynchronous operation in temperatures ranging from -40 to 85°C.
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
SNC54186J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T24;
SNC54186W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Package Style (Meter): FLATPACK;
SNC54S188J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 32 words;
SNC54S188W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
SNC54S2708J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
SNC54S3708J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 1K;
SNC54S470J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 256;
SNC54S472J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 512 words;
SNC54S473J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Technology: TTL;
SNC54S474J
SNC54S475J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 512X8;
SNC54S475W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Maximum Access Time: 85 ns;
SNC54S476J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
SNC54S477J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;
SNC54S478J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns;
SNC54S479J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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